2022 International Conference on Simulation Modeling, Electronic Information Science and Technology (SMEI 2022)
May 13-15, 2022 Dali, China
Conference Information:
Website: www.icsmei.net
Conference Date:May 13-15, 2022
Paper submission deadline: May 08, 2022
Notification of Acceptance: a week after submission
Registration Deadline: May 13, 2022
Indexing:EI Compendex, Scopus
With the maturity and progress of simulation modeling technology, it is more and more widely used in various scientific fields such as industrial engineering, management science, social economy, transportation, ecology and environment, military equipment, etc. It has profoundly influenced the development of information technology and information industry. In order to better promote academic exchange, the 2022 International Conference on Simulation Modeling, Electronic Information Science and Technology (SMEI 2022) will be held on May 13-15,2022 in Dali, China. Researchers and developers in related fields from academia and industry will be widely invited to discuss the latest developments, new theories, new methods and new technologies in simulation modeling and electronic information science and technology, and promote the development of simulation modeling and electronic information science and technology. During the conference, renowned scholars from home and abroad will be invited to give keynote presentations, oral reports and poster presentations, discuss the latest trends and hot issues. Relevant researchers, developers, applicators and experts in related fields are welcome to submit papers for the conference.
Keynote Speaker
Professor. Chun-Yi Su
Gina Cody School of Engineering and Computer Science, Concordia University, Canada
Research Area:
Modeling and control of nonlinear systems
Professor. Na Li
School of Mechano- Electronic Engineering, Xidian University, China
Research Area:
Design of new system antenna based on electromechanical coupling theory
Assoc. Prof. Yongquan Yan
School of statistics, Shanxi University of Finance and Economics, China
Research Area:
Machine learning, dependable computing
Call For Paper
|
Simulation Modeling |
|
|
? Modelling and Simulation ? Agent-based Simulation ? Biomedical visualisation and applications ? Bond chart modelling ? Chaos modelling, control and signal transmission ? Computer games and simulations ? Equipment simulation and modelling ? Discrete and numerical simulation ? Information and scientific visualisation ? Modelling and Simulation Methodology ? Mathematical and numerical methods for ? simulation and modelling ? Object-oriented simulation ? Perceptual issues in visualisation and modelling ? Production, logistics and transport ? Prototyping and simulation ? Simulation of complex systems ? Simulation of intelligent systems ? Visualisation and visualisation |
Process simulation and modelling Knowledge-based simulation Analytical and stochastic modelling techniques and applications Circuit Simulation and Modelling Computational Modelling and Simulation in Science and Engineering Computational and systems biology Discrete events in production, logistics and transport Emerging technologies and applications Finite and boundary element techniques Interaction paradigms and human factors Parallel and distributed computing simulation Simulation in industry, commerce and services Simulation and modelling in molecular biology High Performance Computing and Simulation Modelling, Simulation and Control of Technical Processes Real-time Modelling and Simulation Simulation, experimental science and engineering Internet, network and security visualisation |
|
Electronic Information Science and Technology |
|
|
? Information Application Development and Integration Technology ? Communication and Information Systems ? Power Electronics ? Robotics ? Embedded Systems ? Circuits and Systems ? Radio frequencies ? GPS and wireless positioning ? Mobile computing and edge computing ? Artificial Intelligence ? Aerospace electronics ? Computer Networks ? Antenna and microwave technology ? Smart grid and power system planning, operation, analysis and control ? Digital signal and image processing |
Remote sensing application techniques and new equipment Signal processing and information fusion Automation Radar Engineering Electromagnetic fields and electromagnetic waves Virtual instrumentation Semiconductor devices Physical electronics Integrated stereo imaging and machine vision techniques Artificial neural networks Photonics Internet of Things Fibre optic communication technologies Multimedia services and technology network design, protocols and management Intelligent transport systems |
Publication
All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers of SMEI 2022 will be published in the Conference Proceedings, and it will be submitted to EI Compendex and Scopus for indexing.
Note: All submitted articles should report original, previously unpublished research results, experimental or theoretical. Articles submitted to the conference should meet these criteria and must not be under consideration for publication elsewhere. We firmly believe that ethical conduct is the most essential virtual of any academic. Hence any act of plagiarism is a totally unacceptable academic misconduct and cannot be tolerated.
Submission Methods
1.The submitted papers must not be under consideration elsewhere.
2.Please send the full paper(word+pdf) to SUBMISSION SYSTEM
3.Please submit the full paper, if presentation and publication are both needed.
4.Please submit the abstract only, if you just want to make presentations.
5.Templates Download: Templates
6.Should you have any questions, or you need any materials in English, please contact us at contact_smei@163.com
Registration
For the publication on SMEI 2022 conference proceedings:
|
Items |
Registration Fee |
|
Regular Registration for Paper (4-6 pages) |
500 USD/per paper (4 pages) 3200 CNY/per paper (4 pages) |
|
Package registration ≥ 3 |
450 USD/ per paper (4 pages) 2900 CNY/per paper (4 pages) |
|
Extra Pages (Begin at Page 7) |
50 U, , S, D/ per extra page 300 CNY/per extra pag |
|
Attendees without Submission |
180 USD/per person 1200 CNY/per person |
|
Attendees without Submission (Groups) |
150 USD/per person(≥ 3 person) 1000 CNY/per person(≥ 3 person) |
|
Purchase Extra Journal |
75 USD/book 500 CNY/book |
Program
|
Schedule |
||
|
May.13 |
13:00-17:00 |
Registration |
|
May.14 |
09:00-12:00 |
Speeches of Keynote Speakers |
|
12:00-14:00 |
Lunch |
|
|
14:00-17:30 |
Oral Presentations |
|
|
18:00-19:30 |
Banquet |
|
|
May.15 |
09:00-18:00 |
Academic Investigation |
CONTACT US
Conference Secretary: Pearl Wu
Tel: +86-17620715715(WeChat)
QQ: 1537381910
E-mail: contact_smei@163.com
-
2026 13th International Conferen 8370

-
2026 8th International Conferenc 8314

-
The 7th International Conference 7681

-
The 4th International Conference 7639

-
2026 2nd International Conferenc 7521

-
2026 6th International Conferenc 7385

-
2026 12th International Conferen 7340

-
10th Asia-Pacific Conference on 7023

-
2026 IEEE 18th International Con 6425

-
2026 the 9th International Confe 6372

-
2026 the 15th International Conf 729

-
The 7th International Conference 715

-
2026 10th International Conferen 604

-
2026 the 6th International Sympo 602

-
2026 the 11th International Conf 598

-
2026 14th International Conferen 574

-
2026 10th International Conferen 564

-
2026 16th International Conferen 557

-
2026 10th International Conferen 537

-
2026 8th International Conferen 515

- 05-06 Y** Sign up 2026 International C…

- 05-06 w** Sign up 2026 International C…

- 05-05 闫** Sign up 2026 the 8th Interna…

- 05-04 H** Sign up 2026 The 9th Interna…

- 05-04 M** Sign up 2026 The 9th Interna…

- 05-04 陈** Sign up 2026 The 7th Interna…

- 04-20 张** Sign up 2026 IEEE 3rd Intern…

- 04-11 J** Sign up 2026 9th Internation…

- 04-09 刘** Sign up 2026 6th Internation…

- 04-08 王** Sign up 2026 International C…

- 04-03 魏** Sign up 2026 The 10th Intern…

- 03-26 沈** Sign up 2027 International C…

- 03-26 吾** Sign up 2026 5th Internation…

- 03-26 吾** Sign up 2027 International C…

- 03-18 张** Sign up 2026 4th Internation…

- 03-11 徐** Sign up 2026 12th Internatio…
































































