2022 2nd International Conference on Computational Modeling, Simulation and Data Analysis (CMSDA 2022)
CONFERENCE INFORMATION:
Website:http://www.icmsda.com/
Conference Date:December 9-10, 2022
Venue:ZHENGZHOU, China
Submission Due: Please refer to conference website
Notification: within 1 week after submission
Indexing:EI/Scopus/Google Scholar
Publication History
CMSDA2021丨 SPIE Digital Library丨EI Compendex丨Scopus
2022 2nd International Conference on Computational Modeling, Simulation and Data Analysis (CMSDA 2022) will be held during December 9-10, 2022 in Zhengzhou, China. The conference is co-hosted by Henan University, Henan Academy of Sciences and Henan Association for Science and technology. It dedicates to creating a platform for academic communications between specialists and scholars in the fields of Modeling, Simulation and Data Analysis. The conference will create a path to establish a research relationship for the authors and listeners with opportunities for collaboration and networking among the universities and institutions for promoting research and developing technologies.
CMSDA 2022 will invite well-known scholars at home and abroad to share their latest research results and experiences in related research fields. The reports will be divided into keynote speeches, oral presentations and poster presentations. Conference hot topics include Computer modeling and simulation, Analysis and stochastic modeling techniques and applications, mathematical modeling, big data analysis, etc.
CALL FOR PAPER
Topics of interest for submission include, but are not limited to:
Computational modeling and simulation
Modeling tools and languages
Vision and visualization technology
Problems in visualization and modeling
Modeling and simulation methods
Mathematics and mathematical methods in simulation and modeling
Calculation and simulation
Pervasive Computing and Simulation
Discrete and numerical simulation
Intelligent calculation and simulation
Parallel and computational simulation
Real-time modeling and simulation
Mixed background system modeling, analysis and control
Dynamic modeling and simulation
Intelligent system simulation
Interactive system modeling and simulation
Network-based simulation
Simulation optimization
Emulator
Circuit simulation and modeling
Computer games and simulation
Equipment simulation and modeling
Industrial simulation modeling
Process engineering modeling, simulation and control
Simulation and Modeling in Molecular Biology
Traffic engineering simulation
Circuit simulation and modeling
Aerospace technology simulation
Information Engineering Simulation
Material engineering simulation
Physics-based modelling and simulation
Modeling and simulation technology and other applications, etc.
Data analysis and application
Data mining
Data Management and Database
Exploratory data analysis
Confirmatory data analysis
Qualitative data analysis
High frequency data analysis
Complex data analysis
Big data analysis and application
Data analysis algorithm model
Data analysis method
Data analysis process and improvement
Data analysis scenarios and model applications
Publication
Conference proceedings

English is the official language of the conference. All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published by IEEE CS CPS and submitted to EI Compendex, and Scopus for indexing.
----------------------------------------------------------------------------------------------------------------------
No less than 4 pages
Note: All submitted articles should report original results, experimental or theoretical, not previously published or being under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academic. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.
Participation Types:
Package A: Only Attendance
Package B: Abstract Submission+Oral Presentation
Package C: Abstract Submission+Poster Presentation
Package D: Full Paper Publicaiton+Oral/Poster Presentation+Attendance
Note: If you need paper publication and presentation both, please submit full paper to AIS SYSTEM
If you need to make presentation without publication, please submit abstract only to
Registration Fee
|
Item |
Registration fee (By RMB) |
Registration fee (By US Dollar) |
|
Regular Registration for Full Paper |
3200RMB/per paper (4-6 pages) |
500 USD/per paper (4-6 pages) |
|
Manuscript numbers ≥ 3 |
2900RMB/per paper (4-6 pages) |
450 USD/ per paper (4-6 pages) |
|
Extra Pages (Begin at Page 7) |
300RMB/per extra page |
50 USD/ per extra page |
|
Attendees without Submission |
1200RMB/per person |
200 USD / per person |
Program
* The detailed conference program will be released about one month before the conference
CONTACT US
Conference Secretary: Vivian Wang
Tel: +86-19139737380 (Wechat)
-
The 7th International Conference 7168

-
2026 IEEE 18th International Con 5894

-
2026 the 9th International Confe 5859

-
The 4th International Conference 5761

-
2026 13th International Conferen 5546

-
2026 8th International Conferenc 5488

-
2026 11th International Conferen 5318

-
2026 the International Conferenc 5095

-
CMRAI 2026 5080

-
2026 The 11th International Conf 4729

-
2026 the 15th International Conf 709

-
The 7th International Conference 689

-
2026 the 6th International Sympo 589

-
2026 10th International Conferen 569

-
2026 the 11th International Conf 560

-
2026 14th International Conferen 536

-
2026 10th International Conferen 529

-
2026 16th International Conferen 528

-
2026 10th International Conferen 497

-
2026 the International Conferenc 489

- 02-09 魏** Sign up 2026 International C…

- 02-06 杨** Sign up 2026 7th Internation…

- 01-28 李** Sign up 2026 7th IEEE Intern…

- 01-26 陈** Sign up 2026 10th Internatio…

- 01-16 储** Sign up 2026 the 9th Interna…

- 01-15 姚** Sign up 2026 The 6th Interna…

- 01-04 谷** Sign up 2026 the 15th Intern…

- 12-22 吴** Sign up 2026 IEEE 2nd Intern…

- 12-17 袁** Sign up 2026 the 8th Interna…

- 12-11 杜** Sign up CMRAI 2026

- 11-28 M** Sign up 2026 The 12th Intern…

- 11-22 K** Sign up 2026 10th Asia-Pacif…

- 11-17 k** Sign up 2026 10th Internatio…

- 11-10 王** Sign up 2026 the 6th Interna…

- 11-07 S** Sign up 2026 The 6th Interna…

- 11-04 鲁** Sign up 2026 The 12th Intern…































































