Conference information
Official website: www.oifm.org
Conference date: March 10-12, 2023
Venue: Guangzhou, China
Notice of acceptance/rejection: within 1 week after submission
Index: EI Compendex, Scopus
OIFM 2022 has completed the publication and retrieval of papers!!
Brief introduction of the meeting
2023 2nd International Conference on Optoelectronic Information and Functional Materials(OIFM 2023)will be held on March 10-12, 2023 in Guangzhou, China.
The annual Optoelectronic Information and Functional Materials conference (OIFM) offers delegates and members a forum to present and discuss the most recent research. Delegates and members will have numerous opportunities to join in discussions on these topics. Additionally, it offers fresh perspectives and brings together academics, researchers, engineers, and students from universities and businesses throughout the globe under one roof.
Experts and scholars in related fields are welcome to submit papers for the conference.
Conference Guest
Prof. Yabo Fu
Taizhou University School of Materials Science and Engineering, China
Dr. Rajeev Tiwari
University of Petroleum and Energy Studies (UPES)
Dr. Kolla Bhanu Prakash
KLU · Department of Computer Science and Engineering of K L University
Prof. Harikrishnan Santhanam
Kings Engineering College
Call for paper
The topics of interest for submission include, but are not limited to:
|
(Ⅰ)Optoelectronic information science Optoelectronics Optical communication and optical network Optical fiber communication and system Photoelectric measurement, control and sensing Engineering optics Laser principle and application Optical storage and display technology Spectroscopy Electronic circuit and technology Photoelectric devices Photoelectric signal processing Solar cells Photovoltaic technology Other topics about optoelectronic engineering electromagnetic wave Optical vortex |
|
(Ⅱ)Information and Communication Engineering Communication and information system Wireless communication, data transmission Switching and broadband network Array signal processing Satellite communication Signal and information processing Multimedia and image processing Array signal processing Electromagnetic field and electromagnetic wave Cloud computing Information system and Security Internet of Things Sensor network |
|
(Ⅲ)Materials science and Engineering New materials. Optoelectronic functional materials and devices. Bonding material. Amorphous / crystal material. Biomaterials and their applications. building material. Catalytic ceramic material. Catalytic ceramic material. Chemical materials. Chemical synthetic materials. Coating material. Colloid and material science. Science and Application of Composite Materials. Computer aided material design. Conductive material. Corrosion resistant material. Absorbing material |
Publication
All papers, both invited and contributed, will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers of OIFM 2023 will be published in SPIE - The International Society for Optical Engineering (ISSN: 0277-786X), and indexed by Ei Compendex and Scopus.
◆The paper shall not be less than 4 pages.
◆Download the conference paper template and go to the "Conference Materials" column to download it.
◆Only English manuscripts will be accepted at the meeting. If you need translation services, you can consult the teacher in charge of the meeting.
Submission methods
2023 2nd International Conference on Optoelectronic Information and Functional Materials (OIFM 2023) accepts original and unpublished papers.
A. Full Paper (for Presentation and Publication)
Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceedings.
B. Abstract (Presentation only)
Accepted abstract will be invited to give the oral presentation at the conference, the presentation will not be published.
C. Submission Methods
1)The submitted papers must not be under consideration elsewhere.
2)Please send the full paper (word+pdf) to AIS SUBMISSION SYSTEM
3)Please submit the full paper, if presentation and publication are both needed.
4)Please submit the abstract only, if you just want to make presentations.
Registration
For the publication on OIFM 2023 conference proceedings:
|
Item |
Registration fee (By RMB) |
Registration fee (By US Dollar) |
|
Regular Registration for Paper |
3400RMB per paper (4, -6 <, span style="font-size: 12pt; font-family: Arial;">pages) |
490 USD per paper (4-6 pages) |
|
student Registration |
3000RMB per paper (4-6 pages) |
440 USD per paper (4-6 pages) |
|
Extra Pages (Begin at Page 7) |
300RMB per extra page |
50 USD per extra page |
|
Attendees without Submission |
1200RMB per person |
180 USD per person |
|
Attendees without Submission (Group) |
1000RMB per person (≥ 3 person) |
150 USD per person (≥ 3 person) |
|
Purchase Extra Journal |
500RMB per book |
75 USD per book |
Contact us
Conference secretary: Ms Wu
Tel: +86-13922159104 (Wechat)
QQ: 953092562
E-mail: aeic_oifm@163.com
-
The 7th International Conference 9783

-
2026 8th International Conferenc 9336

-
2026 13th International Conferen 9079

-
The 4th International Conference 8397

-
2026 12th International Conferen 8307

-
2026 6th International Conferenc 8229

-
2026 2nd International Conferenc 8226

-
2026 IEEE 18th International Con 7971

-
10th Asia-Pacific Conference on 7871

-
2026 the 9th International Confe 7353

-
The 7th International Conference 914

-
2026 the 15th International Conf 781

-
2026 10th International Conferen 663

-
2026 the 11th International Conf 638

-
2026 14th International Conferen 633

-
2026 the 6th International Sympo 633

-
2026 10th International Conferen 609

-
2026 the International Conferenc 604

-
2026 16th International Conferen 603

-
2026 10th International Conferen 589

- 08-24 Y** Sign up 2027 11th Internatio…

- 08-12 奕** Sign up The 10th IEEE Confer…

- 08-11 P** Sign up 2027 10th Internatio…

- 08-05 王** Sign up 2026 The 11th Intern…

- 07-31 刘** Sign up 2026 9th Internation…

- 07-23 s** Sign up 2026 the 7th Interna…

- 07-15 韩** Sign up 2026 The 11th Intern…

- 07-14 宁** Sign up 2026 IEEE 14th Inter…

- 07-10 梁** Sign up 2026 8th Internation…

- 07-02 邱** Sign up 2026 International C…

- 06-11 王** Sign up 2027 9th Internation…

- 05-28 汪** Sign up 2026 14th Internatio…

- 05-28 赵** Sign up 2026 the 7th Interna…

- 05-28 马** Sign up 2027 International C…

- 03-26 沈** Sign up 2027 International C…

- 03-26 吾** Sign up 2027 International C…

































































