Conference information
Official website: www.icedme.org
Conference date: Marth 24-26th, 2023
Venue: Suzhou, China
Notice of acceptance/rejection: within 1 week after submission
Index: EI Compendex, Scopus
Brief introduction of the meeting
As a leading role in the global megatrend of scientific innovation, China has been creating a more and more open environment for scientific innovation, increasing the depth and breadth of academic cooperation, and building a community of innovation that benefits all. These endeavors have made new contribution to globalization and creating a community of shared future. It is a yearly International conference which the experts of this kind of field from different areas and countries will be invited to give the relevant speech. ICEDME 2023 is to provide a platform for researchers, professionals and other experts from around the world to present their research results in Electron Device and Mechanical Engineering.
Conference Guest
|
Prof. Qingsheng Zeng(IEEE Senior Member) Nanjing University of Aeronautics and Astronautics, China |
Assoc. Prof. Yipin Wan Chang'an University, China |
Dr. Santhosh Krishna B V New Horizon College of Engineering, Bengaluru, |
Call for paper
Topics of interests are in the broad areas of Electron Device and Mechanical Engineering, including but not limited to:
| Electronic and Embedded Systems |
Modern Circuit Theory and Applications | DSP Real-time Encoding Technology and Signal |
| Micro-optoelectronic Device Technology | Microelectronics | Electronics and Electrical Engineering |
| Embedded Systems | Sensor Research | Antenna Technology |
| RF Components | Circuits, devices and systems | Smart Grid and Circuit |
| Signal and Multimedia Processing | Communication Engineering | Nano Electro Mechanical System |
| Photonics and Optoelectronics | Microcomputer Control Technology | Computer Relaying Integrated Optics and Electro-optics Devices |
| Wireless/Mobile Communication and Computing | Software Specification and Software Assurance | Analysis of Power Quality and System Stability |
| Analog Circuits and Digital Circuits | Antenna and Propagation | Electric Energy Processing |
| Electromagnetic and Photonics | Signal Processing | High Voltage Technology |
| Electro-optical Phenomena of Semiconductors | Insulation Technology |
Modulation, coding, and channel analysis |
| Battery Management System | Circuits and Electronics | Microwave Theory and Techniques |
| Microwave and Millimeter | Electrical Control Technology | Wind Power Equipment |
| Robotics and Atomization Engineering | Remote Control and Techniques of GPS | Signal Integrity Design for High-speed Digital Systems |
| Solar Power Equipment | Analog Electronic Technology | Digital Electronic Technology |
| Computational Electromagnetics and Electromagnetic Simulation Technology | Automatic Control Principle | HVDC Transmission Technology |
| Signals and Systems | Electromagnetic and Photonics | Power System Analysis |
| Automatic Control System | Electrical Machinery |
Publication
After 2-3 experts of the organizing committee have strictly reviewed the contributions of this conference, the papers finally hired will be published in EI catalogue series journals, and then submitted to EI Compendex and Scopus for retrieval.
◆The paper shall not be less than 4 pages.
◆Download the conference paper template and go to the "Conference Materials" column to download it.
◆Only English manuscripts will be accepted at the meeting. If you need translation services, you can go to "Paper Translation" for details or consult the teacher in charge of the meeting.
Submission methods
ICEDME2023 accepts original and unpublished papers.
A. Full Paper (for Presentation and Publication)
Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceedings.
B. Abstract (Presentation only)
Accepted abstract will be invited to give the oral presentation at the conference, the presentation will not be published.
C. Submission Methods
1)The submitted papers must not be under consideration elsewhere.
2)Please send the full paper (word+pdf) to AIS SUBMISSION SYSTEM
3)Please submit the full paper, if presentation and publication are both needed.
4)Please submit the abstract only, if you just want to make presentations.
Program
|
Schedule |
||
|
March 24, 2023 |
13:00-17:00 |
Registration |
|
March 25, 2023 |
09:00-12:00 |
Speeches of Keynote Speakers |
|
12:00-14:00 |
Lunch |
|
|
14:00-17:30 |
Oral Presentations |
|
|
18:00-19:30 |
Banquet |
|
|
March 26, 2023 |
09:00-18:00 |
Academic Investigation |
Contact us
Conference secretary: Ms Ye
Tel: +86-13502443374 (Wechat)
E-mail: icedme@126.com
-
The 7th International Conference 9782

-
2026 8th International Conferenc 9336

-
2026 13th International Conferen 9079

-
The 4th International Conference 8397

-
2026 12th International Conferen 8307

-
2026 6th International Conferenc 8229

-
2026 2nd International Conferenc 8226

-
2026 IEEE 18th International Con 7969

-
10th Asia-Pacific Conference on 7871

-
2026 the 9th International Confe 7353

-
The 7th International Conference 914

-
2026 the 15th International Conf 781

-
2026 10th International Conferen 663

-
2026 the 11th International Conf 638

-
2026 the 6th International Sympo 633

-
2026 14th International Conferen 633

-
2026 10th International Conferen 609

-
2026 the International Conferenc 604

-
2026 16th International Conferen 603

-
2026 10th International Conferen 589

- 08-24 Y** Sign up 2027 11th Internatio…

- 08-12 奕** Sign up The 10th IEEE Confer…

- 08-11 P** Sign up 2027 10th Internatio…

- 08-05 王** Sign up 2026 The 11th Intern…

- 07-31 刘** Sign up 2026 9th Internation…

- 07-23 s** Sign up 2026 the 7th Interna…

- 07-15 韩** Sign up 2026 The 11th Intern…

- 07-14 宁** Sign up 2026 IEEE 14th Inter…

- 07-10 梁** Sign up 2026 8th Internation…

- 07-02 邱** Sign up 2026 International C…

- 06-11 王** Sign up 2027 9th Internation…

- 05-28 汪** Sign up 2026 14th Internatio…

- 05-28 赵** Sign up 2026 the 7th Interna…

- 05-28 马** Sign up 2027 International C…

- 03-26 沈** Sign up 2027 International C…

- 03-26 吾** Sign up 2027 International C…

































































