2024
International Conference on Computing, Machine Learning and Data Science (CMLDS
2024) -EI Compendex
Location:
Singapore
Dates:
April 12-14, 2024
Website:
http://www.cmlds.net/
E-mail: cmlds_conf@163.com
Conference
Format: Online and In-person
2024
International Conference on Computing, Machine Learning and Data Science (CMLDS
2024) will be held during April 12-14, 2024 in Singapore. CMLDS 2024 is to
bring together leading academic scientists, research scholars and researchers
to share and exchange their experiences and research results about all aspects
of Computing, Machine Learning and Data Science. It would also provide a
premier interdisciplinary forum for researchers, practitioners and educators to
present and discuss the most recent innovations, trends, concerns, practical
challenges encountered and the solutions adopted in the field of Computing,
Machine Learning and Data Science.
Prospective
authors are invited to submit high-quality original research and technical
contributions for presentations and posters in conference. Accepted papers will
be included in the conference proceedings.
Topics:
Computer
Modeling
Cloud
Computing
Grid
Computing
Human-centred
Computing
Machine
learning for 5G system
Machine
Learning Trends
Big
Data Technologies
Statistical
Learning
Data
Fusion
Data
Mining & Visualization
(For
more topics: http://www.cmlds.net/topics.html )
Paper
Publication:
All
accepted and registered papers will be included in CMLDS 2024 Conference
Proceeding, published in the ACM International Conference Proceedings Series
(ISBN: 979-8-4007-1639-3), and indexed by Ei Compendex and Scopus
CMLDS
2024 Speakers:
Prof.
Xudong Jiang, Fellow IEEE, Nanyang Technological University, Singapore
Prof.
Henry Leung, Fellow IEEE, Fellow SPIE, University of Calgary, Canada
Prof.
Yanan Sun, Sichuan University, China
Prof.
Chuan-Ming Liu, National Taipei University of Technology, Taiwan
Prof.
Angela Lee Siew Hoong, Sunway University, Malaysia
Paper
Submission (Choose one way to submit your paper):
1.
Submission System: https://cmt3.research.microsoft.com/CMLDS2024/ (Recommend)
2.
Email Submission: cmlds_conf@163.com
You
are also welcome to join us as:
As
Presenter: If you want to share you latest research results by giving
presentation without publish papers, please submit your abstract (300-400
words)
As
Listener: You are also warmly welcomed to take part in CMLDS 2024 as a listener
even though you have no paper to submit.
As
Reviewer: To ensure the fairness and guarantee the quality of CMLDS 2024, we
cordially invite experts and scholars join us as a reviewer.
Contact
us:
Conference
Secretary: Ms. Julia Zhu
Email:
cmlds_conf@163.com
Tel:
+852 95096877
Website: http://www.cmlds.net/
-
The 7th International Conference 9773

-
2026 8th International Conferenc 9331

-
2026 13th International Conferen 9077

-
The 4th International Conference 8397

-
2026 12th International Conferen 8305

-
2026 2nd International Conferenc 8224

-
2026 6th International Conferenc 8222

-
2026 IEEE 18th International Con 7964

-
10th Asia-Pacific Conference on 7866

-
2026 the 9th International Confe 7351

-
The 7th International Conference 914

-
2026 the 15th International Conf 781

-
2026 10th International Conferen 663

-
2026 the 11th International Conf 638

-
2026 the 6th International Sympo 633

-
2026 14th International Conferen 633

-
2026 10th International Conferen 609

-
2026 the International Conferenc 604

-
2026 16th International Conferen 603

-
2026 10th International Conferen 589

- 08-24 Y** Sign up 2027 11th Internatio…

- 08-12 奕** Sign up The 10th IEEE Confer…

- 08-11 P** Sign up 2027 10th Internatio…

- 08-05 王** Sign up 2026 The 11th Intern…

- 07-31 刘** Sign up 2026 9th Internation…

- 07-23 s** Sign up 2026 the 7th Interna…

- 07-15 韩** Sign up 2026 The 11th Intern…

- 07-14 宁** Sign up 2026 IEEE 14th Inter…

- 07-10 梁** Sign up 2026 8th Internation…

- 07-02 邱** Sign up 2026 International C…

- 06-11 王** Sign up 2027 9th Internation…

- 05-28 汪** Sign up 2026 14th Internatio…

- 05-28 赵** Sign up 2026 the 7th Interna…

- 05-28 马** Sign up 2027 International C…

- 03-26 沈** Sign up 2027 International C…

- 03-26 吾** Sign up 2027 International C…





























































