Full name: 2026 the 9th International Conference on Frontiers of Composite Materials (ICFCM 2026)
Abbreviation: ICFCM 2026
Website: http://www.icfcm.org/
Time: June 12-14, 2026
Conference Venue: Fukuoka, Japan
ICFCM Conference Committees:
Conference Committee Chairs:
Kazuo Umemura, Tokyo University of Science, Japan
Ramesh K. Agarwal, Washington University in St. Louis, USA
Program Committee Chairs:
Zhengyi Jiang, University of Wollongong, Australia
Hom Nath Dhakal, University of Portsmouth, UK
Hideaki Tsukamoto, Hosei University, Japan
Proceedings:
All submissions will be peer reviewed by 2-3 reviewers. The registered and presented papers will be published into Materials Science Forum (ISSN print 0255-5476 / ISSN web 1662-9752).
Indexed by Elsevier: SCOPUS.
ICFCM2024 - ISBN: 978-3-0364-0459-2 - Scientific Books Collection Vol. 161 | SCOPUS
ICFCM2022 - ISBN: 978-3-0357-1855-3 - Scientific Books Collection Vol. 88 | SCOPUS
ICFCM2020 - ISBN: 978-3-0357-1816-4 - Materials Science Forum(MSF) Vol. 1041 | SCOPUS, Ei Compendex (CPX)
ICFCM2019 - ISBN: 978-3-0357-1596-5 - Materials Science Forum(MSF) Vol. 995 | SCOPUS, Ei Compendex (CPX)
ICFCM2018 - ISBN: 978-3-0357-1461-6 - Materials Science Forum(MSF) Vol. 951 | SCOPUS, Ei Compendex (CPX)
ICFCM2017 - ISBN: 978-3-0357-1207-0 - Materials Science Forum(MSF) Vol. 923 | SCOPUS, Ei Compendex (CPX)
ICFCM2016 - ISBN: 978-3-0357-1099-1 - Materials Science Forum(MSF) Vol. 894 | SCOPUS, Ei Compendex (CPX)
Call for paper:
1. Additive manufacturing
2. Applications
3. Bio-based composites
4. Biomimetic composites
5. Ceramic matrix composites
6. Concrete and cementitious composites
7. Damage and fracture
8. Durability and ageing
9. Experimental techniques
10. Fibers and matrices
11. FRP reinforced concrete
12. Health monitoring
13. Hybrid composites
14. Infrastructure
15. Interfaces and interphases
For details about topics, please visit at http://www.icfcm.org/cfp.html
Submission:
Please send your abstract/full paper to iconf. Submission System (http://confsys.iconf.org/submission/icfcm2026), Any questions, please feel free to contact via icfcm@saise.org.
1. Full Paper (Presentation and Publication)
Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceeding.
2. Abstract (Presentation only)
Accepted abstract will be invited to give the presentation at the conference, the presentation will not be published.
Conference Schedule:
12 June, 2026: Registration, collecting conference materials
13 June, 2026: Opening Remark & Keynote Speeches & Presentation Sessions & Dinner
14 June, 2026: Social Activity (option)
-
2026 13th International Conferen 8364

-
2026 8th International Conferenc 8309

-
The 7th International Conference 7672

-
The 4th International Conference 7635

-
2026 2nd International Conferenc 7518

-
2026 6th International Conferenc 7379

-
2026 12th International Conferen 7337

-
10th Asia-Pacific Conference on 7009

-
2026 IEEE 18th International Con 6409

-
2026 the 9th International Confe 6368

-
2026 the 15th International Conf 729

-
The 7th International Conference 715

-
2026 10th International Conferen 603

-
2026 the 6th International Sympo 600

-
2026 the 11th International Conf 594

-
2026 14th International Conferen 573

-
2026 10th International Conferen 563

-
2026 16th International Conferen 555

-
2026 10th International Conferen 535

-
2026 8th International Conferen 510

- 05-04 陈** Sign up 2026 The 7th Interna…

- 04-20 张** Sign up 2026 IEEE 3rd Intern…

- 04-11 J** Sign up 2026 9th Internation…

- 04-09 刘** Sign up 2026 6th Internation…

- 04-08 王** Sign up 2026 International C…

- 04-03 魏** Sign up 2026 The 10th Intern…

- 03-26 沈** Sign up 2027 International C…

- 03-26 吾** Sign up 2026 5th Internation…

- 03-26 吾** Sign up 2027 International C…

- 03-18 张** Sign up 2026 4th Internation…

- 03-11 徐** Sign up 2026 12th Internatio…

- 03-03 张** Sign up 2026 10th Internatio…

- 03-01 刘** Sign up 10th Asia-Pacific Co…

- 02-25 K** Sign up 2026 9th Artificial …

- 02-09 魏** Sign up 2026 International C…

- 01-28 李** Sign up 2026 7th IEEE Intern…



























































