2026 The 10th International Conference on Materials Sciences and Nanomaterials (ICMSN 2026)
July 1-4, 2026
London, United Kingdom
Website: https://www.icmsn.org/
Publication:
The registered and presented papers will be published into Materials Science Forum (ISSN print 0255-5476 / ISSN web 1662-9752), which will be indexed by Scopus, Chemical Abstracts Service (CAS), REAXYS, Chimica, etc.
Conference Committees in 2025:
Conference Chairs:
Yuyuan Zhao, Ningbo University of Technology, China & University of Liverpool, UK (formerly)
Alexander M. Korsunsky, Vice President, Trinity College, University of Oxford, UK
Program Chairs:
Anja Pfennig, HTW-Berlin University of Applied Sciences, Germany
Edward M. Sabolsky, West Virginia University, USA
Teik-Cheng Lim, Singapore University of Social Sciences, Singapore
Publicity Committee:
Changhong Ke, State University of New York at Binghamton, USA
Steven Frederick Durrant, Instituto de Ciência e Tecnologia de Sorocaba, UNESP, Brazil
Zuruzi Abu Samah, Alfaisal University, Kingdom of Saudi Arabia
Wasawat Nakkiew, Mae Fah Luang University, Thailand
For more details, you can visit: https://icmsn.org/com.html
Looking forward to conference committees in 2026.
Speakers:
Prof. Alexander M. Korsunsky, Trinity College, University of Oxford, UK
Prof. Ludmila Kucerova, University of West Bohemia, Czech
Assoc. Prof. Nader Shehata, Kuwait College of Science and Technology, Kuwait
Assist. Prof. Tianhong Gu, Xi'an Jiaotong – Liverpool University, China
Prof. Mohammed Al-Hashimi, Hamad Bin Khalifa University, Qatar and Texas A&M University Qatar, Qatar
For more details, you can visit: https://icmsn.org/speakers.html
Looking forward to keynote speaker in 2026.
Conference topics (but not limited to):
Topic 1: Nanomaterials
Different Methods for Growth of Nanostructures
Nanostructured Thin Films and Coatings
Doped Nanomaterials
Topic 2: Electronic Materials
Semiconductor Materials
Display Materials
Battery Materials
Topic 3: Material Chemistry
Classical Analytical Chemistry
Instrumental Analysis
Optical Analysis
Topic 4: Materials Processing Engineering
Metallurgy Technology
Polymer Materials
Polymer Processing
Topic 5: Structural Material
Wrought Iron
Cast Iron
Steel
For more details, you can visit: https://icmsn.org/cfp.html
Submission Types:
1. Full Paper (Publication & Presentation)
Full Paper should be no less than 6 pages under the template.
2. Abstract (Presentation ONLY)
Abstract registration is for Presentation ONLY. Abstract will NOT be published.
Submission Methods:
1. You can submit your paper via submission system: https://confsys.iconf.org/submission/icmsn2026
2. Or directly send to the conference email box: icmsn@cbees.net
For more details, you can visit: https://icmsn.org/sub.html
-
The 7th International Conference 7165

-
2026 IEEE 18th International Con 5885

-
2026 the 9th International Confe 5849

-
The 4th International Conference 5513

-
2026 11th International Conferen 5315

-
2026 13th International Conferen 5293

-
2026 8th International Conferenc 5237

-
2026 the International Conferenc 5087

-
CMRAI 2026 5073

-
2026 The 11th International Conf 4719

-
2026 the 15th International Conf 709

-
The 7th International Conference 689

-
2026 the 6th International Sympo 588

-
2026 10th International Conferen 568

-
2026 the 11th International Conf 558

-
2026 14th International Conferen 536

-
2026 10th International Conferen 529

-
2026 16th International Conferen 528

-
2026 10th International Conferen 497

-
2026 the International Conferenc 489

- 02-09 魏** Sign up 2026 International C…

- 02-06 杨** Sign up 2026 7th Internation…

- 01-28 李** Sign up 2026 7th IEEE Intern…

- 01-26 陈** Sign up 2026 10th Internatio…

- 01-16 储** Sign up 2026 the 9th Interna…

- 01-15 姚** Sign up 2026 The 6th Interna…

- 01-04 谷** Sign up 2026 the 15th Intern…

- 12-22 吴** Sign up 2026 IEEE 2nd Intern…

- 12-17 袁** Sign up 2026 the 8th Interna…

- 12-11 杜** Sign up CMRAI 2026

- 11-28 M** Sign up 2026 The 12th Intern…

- 11-22 K** Sign up 2026 10th Asia-Pacif…

- 11-17 k** Sign up 2026 10th Internatio…

- 11-10 王** Sign up 2026 the 6th Interna…

- 11-07 S** Sign up 2026 The 6th Interna…

- 11-04 鲁** Sign up 2026 The 12th Intern…






























































