Full name: The 6th International Forum on Signal Processing
Abbreviation: IFSP 2026
Venue: Harbin, China
Time: July 10-12, 2026
Conference Committees
Honorary Chair
Lu Gao, Harbin Engineering University, China & National Key Laboratory of Test Physics and Numerical Mathematics of Space Vehicle, China
Conference Chairs
Alfonso Farina, University College London, UK (FREng, FIET, LFIEEE, Fellow of EURASIP, EurASc)
Qun Wan, University of Electronic Science and Technology of China, China
Nan Su, Harbin Engineering University, China
Program Chairs
Li Zhang, University of Leeds, UK
Li Cheng, University of Alberta, Canada
Danilo Orlando, University of Pisa, Italy
Chengpeng Hao, University of Chinese Academy of Sciences, China
Jun Liu, Chengdu University of Information Technology, China
For more conference committees, please kindly check it via: https://www.ifsp.net/com.html
Keynote Speakers & Invited Speakers
Prof. Guangtao Zhai (IEEE Fellow), Shanghai Jiao Tong University, China
Prof. Qing Shen, Beijing Institute of Technology, China
Assoc. Prof. Xu Chen, Harbin Engineering University, China
Assoc. Prof. Yang Su, Nanjing University of Information Science and Technology, China
Assoc. Prof. Shuang Xiao, Harbin Engineering University, China
Prof. Liang Cheng, Harbin Medical University, China
Publication:
Option One:
Submitted papers will go through a rigorous peer review process, and finally accepted papers after registration and presentation will be published in the IFSP 2026 conference proceedings and submitted to IEEE Xplore and possible indexing by Ei Compendex and Scopus.
Option Two:
Accepted papers of IFSP 2026 will be published in IET Conference Proceedings, which will be included in the IET Digital Library and IEEE Xplore and submitted to EI Compendex and Scopus for indexing.
Topics:
Topics of interest for submission include, but are not limited to:
Track 1: Image and video processing
- Image and video compression
- Image and video analysis and segmentation
- Image and video enhancement and restoration
- 3D imaging and visualization
Track 2: Speech and audio processing
- Speech recognition and synthesis
- Audio analysis and processing
- Speaker recognition and verification
- Speech enhancement and dereverberation
Track 3: Signal processing for communication systems
- Wireless communication systems
- Digital signal processing for communications
- MIMO systems and space-time processing
- Channel estimation and equalization
Track 4: Signal processing for biomedical applications
- Biomedical signal processing
- Medical imaging and image processing
- Biosignal analysis and classification
- Brain-computer interfaces
Track 5: Machine learning for signal processing
- Deep learning for signal processing
- Reinforcement learning for signal processing
- Sparse signal processing
- Dimensionality reduction techniques
Track 6: Signal processing for sensor networks
- Distributed signal processing
- Sensor data fusion
- Sensor localization and tracking
- Energy-efficient signal processing for sensor networks
Track 7: Signal processing for control and automation
- Control theory and systems
- Robotics and automation
- Intelligent control systems
- Adaptive and nonlinear control systems
Track 8: Signal processing for multimedia applications
- Multimedia communication systems
- Multimedia content analysis and indexing
- Multimedia security and forensics
- Human-computer interaction
Track 9: Signal processing for security and surveillance
- Video surveillance systems
- Object recognition and tracking for security
- Biometric signal processing
- Signal processing for encryption and decryption
For more topics, please visit: http://www.ifsp.net/cfp.html.
Submission Guideline:
1. English is the official language. Paper should be prepared and presented in English.
2. Full paper (5 Pages in two-column format) submission is required for Publication and Presentation. For presentation only, just send us the abstract.
3. Submission:
- By online submission system: https://confsys.iconf.org/submission/ifsp2026
- Submit to ifsp_contact@yeah.net as attachment. The email subject should be named as "Submission-IFSP 2026-Full Paper/ Abstract"
General Program:
Day 1 - Friday - July 10, 2026
10:00-17:00 | Registration & Materials Collection
14:30-16:00 | Campus Tour
14:30-17:00 | Committee Conference
Day 2 - Saturday - July 11, 2026
09:00 - 09:10 | Opening Ceremony
09:10 - 12:00 | Keynote Speeches
12:00 - 13:30 | Lunch
13:30 - 18:00 | Author Oral and Poster Sessions
18:00 - 20:30 | Award Ceremony & Dinner Banquet
Day 3 - Sunday - July 12, 2026
09:00 - 12:00 | Invited Speeches
13:30 - 18:00 | City Tour in Harbin
-
2026 13th International Conferen 8364

-
2026 8th International Conferenc 8309

-
The 7th International Conference 7672

-
The 4th International Conference 7635

-
2026 2nd International Conferenc 7518

-
2026 6th International Conferenc 7379

-
2026 12th International Conferen 7337

-
10th Asia-Pacific Conference on 7009

-
2026 IEEE 18th International Con 6409

-
2026 the 9th International Confe 6368

-
2026 the 15th International Conf 729

-
The 7th International Conference 715

-
2026 10th International Conferen 603

-
2026 the 6th International Sympo 600

-
2026 the 11th International Conf 594

-
2026 14th International Conferen 573

-
2026 10th International Conferen 563

-
2026 16th International Conferen 555

-
2026 10th International Conferen 535

-
2026 8th International Conferen 510

- 05-04 陈** Sign up 2026 The 7th Interna…

- 04-20 张** Sign up 2026 IEEE 3rd Intern…

- 04-11 J** Sign up 2026 9th Internation…

- 04-09 刘** Sign up 2026 6th Internation…

- 04-08 王** Sign up 2026 International C…

- 04-03 魏** Sign up 2026 The 10th Intern…

- 03-26 沈** Sign up 2027 International C…

- 03-26 吾** Sign up 2026 5th Internation…

- 03-26 吾** Sign up 2027 International C…

- 03-18 张** Sign up 2026 4th Internation…

- 03-11 徐** Sign up 2026 12th Internatio…

- 03-03 张** Sign up 2026 10th Internatio…

- 03-01 刘** Sign up 10th Asia-Pacific Co…

- 02-25 K** Sign up 2026 9th Artificial …

- 02-09 魏** Sign up 2026 International C…

- 01-28 李** Sign up 2026 7th IEEE Intern…



























































