Full Name: 2026 the 15th International Conference on Engineering and Innovative Materials (ICEIM 2026)
Abbreviation: ICEIM 2026
Place: Kyoto, Japan
Date: August 5-7, 2026
Website: http://www.iceim.org/
Co-sponsored by: Tokyo Denki University and Kyoto University of Advanced Science
Hosted by: Kyoto University of Advanced Science
Technically Co-sponsored by: Osaka Institute of Technology
CALL FOR PAPERS:
Topic 1: Materials Science and Engineering
Metallic alloys
Ceramics and glasses
Nanomaterials and technology
Composites
Polymers
Biomaterials
Functional materials
Metamaterials
Optical/Electronic/Magnetic materials
Smart/Intelligent materials & intelligent systems
Superconducting materials
Semiconductor materials
Microelectronic materials
Sensors and actuators
Coating and film
Micro-nano fluids
Materials for energy storage
Material chemistry
Advanced engineering materials
Material Physics
Condensed Matter Physics
Phase Transformations and Thermodynamics
Topic 2: Materials Processing and Manufacturing
Casting
Welding, Sintering, Heat Treatment
Surface engineering/Coating
Material forming
Powder metallurgy
Surface treatment
Machining
Flexible manufacturing technology & system
Micro and nano-fabrication
Rapid prototyping
Additive manufacturing
Laser processing technology
Topic 3: Material Simulation, Preparation and Characterization
Materials design
Advanced processing technology of materials
Analysis and characterization of materials interface & surface
New technologies and theories of materials characterization
X-ray phase analysis
Materials genome engineering
Materials simulation, computation, and design
Computational material science
Artificial intelligence technology in materials science and engineering
Metallography
Residual life analysis
Materials science and engineering databases
Topic 4: Materials Properties, Measuring Methods and Applications
Ductility
Creep resistance
Electrical properties
Deformation and fracture mechanics
Stress-strain behaviour
Fatigue
Corrosion
Crack resistance
Magnetic properties
Wear resistance
Friction and wear
Non-destructive testing
Working properties of materials and structures
For details about topics, please visit http://www.iceim.org/call-for-papers.html
PUBLICATION:
1. Key Engineering Materials (ISSN print 1013-9826; ISSN cd 1662-9809; ISSN web 1662-9795)
Index: SCOPUS, REAXYS, Inspec, CAS, ProQuest, Google Scholar, etc.
2. Applied Mechanics and Materials (ISSN print 1660-9336, ISSN cd 2297-8941, ISSN web 1662-7482)
Index: Inspec, CAS, ProQuest, Google Scholar, etc.
SUBMISSION:
1. Full Paper (Publication and Presentation)
2. Abstract (Presentation Only)
3. Special Session
Please upload your full paper/abstract to https://www.zmeeting.org/submission/iceim2026
Please submit proposal for special session to iceim_conf@vip.163.com .
For more information, please visit http://www.iceim.org/call-for-sessions.html
CONFERENCE SCHEDULE:
August 5, 2026---Conference Registration and Materials Collection, Academic Visit
August 6, 2026---Keynotes & Breakout Sessions
August 7, 2026---Breakout Sessions
-
2026 13th International Conferen 8625

-
2026 8th International Conferenc 8574

-
The 7th International Conference 8395

-
The 4th International Conference 7833

-
2026 2nd International Conferenc 7734

-
2026 6th International Conferenc 7672

-
2026 12th International Conferen 7609

-
10th Asia-Pacific Conference on 7308

-
2026 IEEE 18th International Con 7216

-
2026 the 9th International Confe 6664

-
The 7th International Conference 801

-
2026 the 15th International Conf 767

-
2026 10th International Conferen 642

-
2026 the 11th International Conf 627

-
2026 the 6th International Sympo 622

-
2026 14th International Conferen 609

-
2026 10th International Conferen 587

-
2026 16th International Conferen 582

-
2026 10th International Conferen 567

-
2026 8th International Conferen 555

- 07-06 R** Sign up 2026 The 8th Interna…

- 07-03 郝** Sign up 2026 International C…

- 07-02 邱** Sign up 2026 International C…

- 07-01 余** Sign up 2026 11th Internatio…

- 07-01 H** Sign up 2026 IEEE 9th Intern…

- 06-28 W** Sign up 2026 International C…

- 06-27 梁** Sign up 2026 International C…

- 06-15 Y** Sign up 2026 International C…

- 06-11 王** Sign up 2027 9th Internation…

- 06-10 杨** Sign up 2026 7th Internation…

- 06-10 杨** Sign up 2026 IEEE 9th Intern…

- 05-28 汪** Sign up 2026 14th Internatio…

- 05-28 赵** Sign up 2026 the 7th Interna…

- 05-28 马** Sign up 2027 International C…

- 05-27 李** Sign up 2026 9th Internation…

- 05-22 Y** Sign up 2026 9th Asia Confer…































































