Full name: 2026 IEEE 9th International Conference on Signal Processing and Machine Learning (SPML 2026)
Abbreviation: SPML 2026
Conference Website: http://www.spml.net
SPML 2026 information:
1. SPML 2026 is co- sponsored by Hangzhou Dianzi University, China and IEEE, co-hosted by China University of Mining and Technology, China, Inner Mongolia University, China and Xijing University, China. And Tianjin University of Science and Technology, China, Shanxi University, China, Shandong University of Science and Technology, China, Newcastle University in Singapore, Singapore, Taylor's University, Malaysia and Tianjin Research Institute for Water Transport Engineering M.O.T, China, Haiweitong Network Technology Co., Ltd., China, University of the Fraser Valley, Canada and Universiti Tunku Abdul Rahman, Malaysia are the patrons.
2. The accepted and registered papers can be published in conference proceedings to be archived into IEEE Xplore? Digital Library, which will be submitted to EI Compendex and Scopus for indexing.
3. Prof. Xudong Jiang (IEEE Fellow) from Nanyang Technological University, Singapore, Prof. Dan Zeng from Shanghai University, China and Prof. Honggang ZHANG (IEEE Fellow, AAIA Fellow) from Macau University of Science and Technology, China will be the keynote speakers.
4. Prof. Miao Hu from Hangzhou Dianzi University, China and Prof. Wei Chen from China University of Mining and Technology, China are the conference chairs.
5. Publication:
All the accepted and registered papers in SPML 2020 have been published into ACM conference proceedings (ISBN: 978-1-4503-7573-3), which have been indexed by EI Compendex and Scopus.
All the accepted and registered papers in SPML 2021 have been published into ACM conference proceedings (ISBN: 978-1-4503-9017-0), which have been indexed by EI Compendex and Scopus.
All the accepted and registered papers in SPML 2022 have been published into ACM conference proceedings (ISBN: 978-1-4503-9691-2), which have been indexed by EI Compendex and Scopus.
All the accepted and registered papers in SPML 2023 have been published into ACM conference proceedings (ISBN: 979-8-4007-0757-5), which have been indexed by EI Compendex and Scopus.
All the accepted and registered papers in SPML 2024 have been published into ACM conference proceedings (ISBN: 979-8-4007-1719-2), which have been indexed by EI Compendex and Scopus.
All the accepted and registered papers in SPML 2025 have been published into IEEE conference proceedings (ISBN: 979-8-3315-1369-6), which have been indexed by EI Compendex and Scopus.
Conference Venue:
Hangzhou Dianzi University, Hangzhou, China
Address: No. 1158, 2nd Street, Baiyang Street, Qiantang District, Hangzhou City
-
The 7th International Conference 9731

-
2026 8th International Conferenc 9292

-
2026 13th International Conferen 9065

-
The 4th International Conference 8367

-
2026 12th International Conferen 8257

-
2026 2nd International Conferenc 8186

-
2026 6th International Conferenc 8177

-
2026 IEEE 18th International Con 7922

-
10th Asia-Pacific Conference on 7829

-
2026 the 9th International Confe 7307

-
The 7th International Conference 912

-
2026 the 15th International Conf 780

-
2026 10th International Conferen 662

-
2026 the 11th International Conf 637

-
2026 the 6th International Sympo 632

-
2026 14th International Conferen 632

-
2026 10th International Conferen 609

-
2026 the International Conferenc 604

-
2026 16th International Conferen 602

-
2026 10th International Conferen 588

- 08-24 Y** Sign up 2027 11th Internatio…

- 08-12 奕** Sign up The 10th IEEE Confer…

- 08-11 P** Sign up 2027 10th Internatio…

- 08-05 王** Sign up 2026 The 11th Intern…

- 07-31 刘** Sign up 2026 9th Internation…

- 07-23 s** Sign up 2026 the 7th Interna…

- 07-15 韩** Sign up 2026 The 11th Intern…

- 07-14 宁** Sign up 2026 IEEE 14th Inter…

- 07-10 梁** Sign up 2026 8th Internation…

- 07-02 邱** Sign up 2026 International C…

- 06-11 王** Sign up 2027 9th Internation…

- 05-28 汪** Sign up 2026 14th Internatio…

- 05-28 赵** Sign up 2026 the 7th Interna…

- 05-28 马** Sign up 2027 International C…

- 03-26 沈** Sign up 2027 International C…

- 03-26 吾** Sign up 2027 International C…





























































