Full Name: 2026 IEEE International Zhejiang Power Electronics Conference (ZPEC 2026)

Abbreviation:  ZPEC 2026

Date: August 14-16, 2026

Venue: Hangzhou, China

Website: https://www.zpec.org.cn

Sponsor

Zhejiang University

Technical Sponsors

IEEE Power Electronics Society

China Power Supply Society

IEEE Power Electronics Society Zhejiang / Jiangsu / Anhui Chapter

Organizing Committee

General Chair

Dehong XU, Zhejiang University, China

General Co-Chairs

Yenan CHEN, Zhejiang University, China

Hong LI, Zhejiang University, China

Junming ZHANG, Zhejiang University, China

Wuhua LI, Zhejiang University, China

Technical Program Chair

Yongheng YANG, Zhejiang University, China

TPC Co-Chairs

Meiqin MAO, Hefei Uni. Technology, China

Xinbo RUAN, Nanjing Uni. Aeron. & Astro., China

Bo ZHANG, South China Uni. Technology, China

Alian CHEN, Shandong University, China

Rui LI, Shanghai Jiao Tong University, China

Industry Chair

Alpha J. ZHANG, Delta Electronics Inc., China

Tutorial Chairs

Ke MA, Shanghai Jiao Tong University, China

Jingxin HU, Nanjing Uni. Aeron. & Astro., China

Publication Chair

Min CHEN, Zhejiang University, China

Student & YP Activities

Rujing ZHANG, Zhejiang University, China

Steering Committee Co-Chairs

Johan ENSLIN, Clemson Uni., USA

Frede BLAABJERG, Aalborg Uni., Denmark

Brad LEHMAN, Northeastern Uni., USA

Liuchen CHANG, Uni. New Brunswick, Canada

Secretariat

Sihui HONG, Zhejiang University, China

Yuming LIAO, Zhejiang University, China

Shuang JI, Zhejiang University, China

TPC Members

Alper AKPOLAT, Marmara University, Turkey

Han CUI, Tianjin University, China

Feixiong CHEN, Fuzhou University, China

Guipeng CHEN, Xiamen University, China

Jingyang FANG, Shandong University, China

Lijun HANG, Hangzhou Dianzi University, China

Yuying HE, Hohai University, China

Zhicong HUANG, South China Uni. Technology, China

Chi-Seng LAM, University of Macau, Macau, China

Binbin LI, Harbin Institute of Technology (HIT), China

Helong LI, Hefei University of Technology, China

Fei LI, Hefei University of Technology, China

Shouxiang LI, Beijing Institute of Technology, China

Fanfan LIN, Zhejiang Uni. Int'l Campus, China

Xiong LIU, Jinan University, China

Yitao LIU, Shenzhen University, China

Riccardo MANDRIOLI, University of Bologna, Italy

Nick PAPANIKOLAOU, Democritus Uni. Thrace, Greece

Hafsa QAMAR, Lahore Uni. Management Sciences, Pakistan

Zi'an QIN, Delft Uni. Tech. (TU Delft), The Netherlands

Pengju SUN, Chongqing University, China

Qingsong WANG, Southeast University, China

Rui WANG, Northeast University, China

Fei WANG, Shanghai University, China

Ping WANG, Hong Kong Uni. Sci. Tech., Hong Kong, China

Shuo WANG, University of Nottingham Ningbo, China

Huiqing WEN, Xi'an Jiaotong-Liverpool Uni., China

Chao WU, Shanghai Jiao Tong University, China

Zhen XIN, Hebei University of Technology, China

Jinming XU, Nanjing Uni. Aeron. & Astro., China

Shuo YAN, RMIT University, Australia

Yun YANG, Nanyang Technological Uni., Singapore

Jia YAO, Nanjing Institute of Technology, China

Kai YAO, Nanjing Institute of Technology, China

Zhilei YAO, Shanghai Maritime University, China

Chen ZHANG, Shanghai Jiao Tong University, China

Damin ZHANG, Xiamen Institute of Technology, China

Longlong ZHANG, China Uni. Petroleum (East China), China

Qianjin ZHANG, Anhui University of Technology, China

Yi ZHANG, The Hong Kong Polytechnic Uni., Hong Kong, China

Yuhao ZHANG, The Uni. of Hong Kong, Hong Kong, China

Zhenbin ZHANG, Shandong University, China

Rongwu ZHU, HIT Shenzhen, China

Dao ZHOU, Aalborg University, Denmark

Topics of Interest-

1. Systems & Applications

Datacenter (Including AI), Telecom Power Architecture

Renewable Energy Systems: Photovoltaic, Wind, Fuel Cells, etc.

Critical Power and Energy Storage Systems

Active Grid Support Technologies

Transportation Power Electronics

AI in Power Electronics and Systems

2. Power Converters

AC-DC Converters

DC-DC Converters

DC-AC Inverters

Wireless Power Transfer

Control, Modelling and Simulation for Power Converters

3. Devices & Components

Wide Bandgap Power Device and Module

Gate Driver and Integrated Circuit

Thermal Management and Advanced Cooling Technologies

Passive Components

4. Other Emerging Topics in Power Electronics

Conference Publication:

Accepted papers will be submitted into IEEE Xplore subject to meeting IEEE Xplore's scope and quality requirements.

Submission Link: 

https://easychair.org/conferences/?conf=zpec2026