Meetings: 34813
2027 The 10th International Conference on Materials Engineering and Applications (ICMEA 2027) 2027-1-12 venue:JAPAN

2027 The 10th International Conference on Materials Engineering and Applications (ICMEA 2027)

January 12-15, 2027

Tokyo, Japan

Website: https://www.icmea.org/


Publication:

Accepted papers will be published in below listed journals of Scientific.Net collection. Papers will be sent for indexing by Scopus, Inspec, Chemical Abstracts Service, Google Scholar etc.


>>Materials Science Forum (MSF)

ISSN print 0255-5476

ISSN web 1662-9752


>>Key Engineering Materials (KEM)

ISSN print 1013-9826

ISSN web 1662-9795


>>Solid State Phenomena (SSP)

ISSN print 1012-0394

ISSN web 1662-9779


>>Defect and Diffusion Forum (DDF)

ISSN print 1012-0386

ISSN web 1662-9507


Conference Committees in 2026:

Conference Chair

Jae-Jin Shim, Yeungnam University, South Korea


Conference Co-Chairs

Tran Doan Hung, Vice Rector, Nha Trang University, Vietnam

Huynh Dang Chinh, Vice President, Hanoi University of Science and Technology, Vietnam


Program Chairs

Anja Pfennig, HTW-Berlin University of Applied Sciences, Germany

Guy Le Lay, Aix-Marseille Université, France

Sarawut Rimdusit, Chulalongkorn University, Thailand


Program Co-Chairs

Anatoly Zinchenko, Nagoya University, Japan

Chupong Pakpum, Maejo University, Thailand


Regional Chairs

Takashige Omatsu (Fellow of JSAP, OSA, SPIE), Chiba University, Japan

Dae-Eun Kim, Yonsei University, South Korea


Local Advisory Committee

Phuong Tuyet Nguyen, The University of Science, Viet Nam National University Ho Chi Minh City, Vietnam


Local Organizing Chairs

Nguyen Van Hoa, Nha Trang University, Vietnam

Dang Trung Dung, Hanoi University of Science and Technology, Vietnam

For more committees, you can visit: https://icmea.org/committee.html

Looking forward to the 2027 Conference Committees!


Keynote Speakers in 2026:

Prof. Liang Li, Soochow University, China

Prof. Shinji Takeoka, Waseda University, Japan

Prof. Yun Suk Huh, Inha University, South Korea

Prof. Yang Bai, University of Science and Technology Beijing, China

Prof. Jae-Jin Shim, Yeungnam University, South Korea

For more details, you can visit: https://icmea.org/keynote-speaker.html

Looking forward to the 2027 keynote speakers!


Invited Speakers in 2026:

Prof. Songhun Yoon, Chung-Ang University, Republic of Korea

Assoc. Prof. Kiyoung Lee, Inha University, South Korea

Assoc. Prof. Khoa V. Le, Tokyo University of Science, Japan

Assoc. Prof. Young-Ki Kim, Pohang University of Science and Technology, Republic of Korea

Assist. Prof. Sulki Park, Jeonbuk National University, Republic of Korea

For more details, you can visit: https://icmea.org/invited-speaker.html

Looking forward to the 2027 invited speakers!


Conference Topics (but not limited to):

1. Materials Science And Engineering, Materials Processing Technology

Metallic Alloys, Tool Materials, Ceramics and Glasses, Composites, Nanomaterials, Biomaterials, Multifunctional Materials, Biomaterials, sensors and surfaces, Multi Functional Magnetic Materials, Superconducting Materials


2. Materials Properties, Measuring Methods And Applications

Ductility, Crack Resistance, Fatigue, Fracture Mechanics, Mechanical Properties, Electrical Properties, and Magnetic Properties, Corrosion, Erosion, Wear Resistance, Non-Destructive Testing, Reliability Assessment, Toxicity

Please check the following link which you can find more topics: https://icmea.org/cfp.html


Submission Types:

1. Full Paper (Publication & Presentation)

A minimum length of 6 pages for a paper including all figures, tables, and references.

2. Abstract (Presentation ONLY)

Within 300 words

Abstract registration is for Presentation ONLY. The abstract will NOT be published.


Submission Method:

You can submit your paper via submission system: https://confsys.iconf.org/submission/icmea2027

Or directly send to the conference email box: icmea@cbees.net

For more details, you can learn through: https://icmea.org/submission.html


Conference Venue:

Morito Memorial Hall (東京理科大学-森戸記念館)

Kagurazaka Campus, Tokyo University of Science

Address: 4-2-2 Kagurazaka, Shinjuku-ku, Tokyo, Japan 東京都新宿区神楽坂4-2-2

Conference website
Recommend

学术科研网址导航,430+站,定制学术书签

2026年第五届云计算、计算机视觉和图像处理.

2026年动力学与机械工程国际学术研讨会 (.

2026年IEEE第八届软件工程和计算机科学.

2026年第八届计算机图形学、图像与可视化国.

第八届信息科学、电气与自动化工程国际学术会议.

第三届机器学习与智能计算国际学术会议(MLI.

第六届自动化控制、算法与智能仿生国际学术会议.

2026 年第三届计算,机器学习与数据科学国.

第十三届先进制造技术与材料工程国际学术会议 .

第二届人工智能与产品设计国际学术会议 (AI.

2026年多尺度人工智能国际会议(MAI 2.

2026年量子计算与人工智能国际学术会议(I.

2026年第六届计算机视觉与模式分析国际学术.

第七届机械仪表与自动化国际学术会议(ICMI.

2026年第四届亚洲机器学习、算法与神经网络.

2026年第四届亚洲计算机视觉、图像处理与模.

2026年人工智能与数据挖掘国际学术会议(A.

2026年IEEE第七届计算,网络与物联网国.

2026年第五届网络、通信与信息技术国际会议.

2026年智能机器人与控制技术国际会议(CI.

2026年传感器技术、自动化与智能制造国际会.

2026年智能系统与计算国际会议 (ICIS.

2026年电子, 通信与计算机科学国际会议 .

2026年IEEE第三届先进机器人, 自动化.

2026年第七届控制, 机器人与智能系统国际.