Abbreviation: ICMEM 2027
Place: Osaka, Japan
Time: March 28-31, 2027
Publication:
Accepted papers will be published in below listed journals of Scientific.Net collection. Indexed by Scopus, Inspec, Google Scholar etc.
Defect and Diffusion Forum (DDF)
Solid State Phenomena (SSP)
Materials Science Forum (MSF)
Key Engineering Materials (KEM)
Past Proceedings:
ICMEM 2025: Vol. 1027. Key Engineering Materials-ISBN: 978-3-0364-0948-1-Online Linkage | Indexed by Scopus
ICMEM 2024: Vol. 155. Advances in Science and Technology-ISBN: 978-3-0364-0643-5-Online Linkage | Indexed by Scopus
ICMEM 2023: Vol. 963. Key Engineering Materials-ISBN: 978-3-0364-0434-9-Online Linkage | Indexed by Scopus
ICMEM 2022: Vol. 337. Solid State Phenomena-ISBN: 978-3-0364-1171-2-Online Linkage | Indexed by Scopus
ICMEM 2021: Vol. 324. Solid State Phenomena-ISBN: 978-3-0357-1859-1-Online Linkage | Indexed by Ei Compendex & Scopus
Topics:
Track 1: Advanced Manufacturing and Production Engineering
Track 2: Smart Manufacturing Systems and Digitalization
Track 3: Automation, Robotics and Control
Track 4: Materials Science and Engineering
Track 5: Nanomaterials, Surface and Functional Materials
Track 6: Emerging Materials and Intelligent Technologies
Submission Method:
1. Please log in the Electronic Submission System to submit your full paper and abstract.
2. Send the file as attachment to email directly.
Conference Schedules:
March 28, 2027--Reception & Conference Materials Collection
March 29, 2027--Opening Remarks, Keynote Speeches and Parallel Sessions
March 30, 2027--Invited Speeches and Parallel Sessions
March 31, 2027--Social Activity
Conference Venue:
Osaka International Convention Center
Address: 5-3-51 Nakanoshima, Kita-ku, Osaka City, 530-0005 Japan
-
The 7th International Conference 9677

-
2026 8th International Conferenc 9236

-
2026 13th International Conferen 9038

-
The 4th International Conference 8344

-
2026 12th International Conferen 8208

-
2026 2nd International Conferenc 8144

-
2026 6th International Conferenc 8140

-
2026 IEEE 18th International Con 7864

-
10th Asia-Pacific Conference on 7792

-
2026 the 9th International Confe 7253

-
The 7th International Conference 909

-
2026 the 15th International Conf 779

-
2026 10th International Conferen 658

-
2026 the 11th International Conf 637

-
2026 the 6th International Sympo 632

-
2026 14th International Conferen 631

-
2026 10th International Conferen 605

-
2026 16th International Conferen 601

-
2026 the International Conferenc 600

-
2026 10th International Conferen 587

- 08-24 Y** Sign up 2027 11th Internatio…

- 08-12 奕** Sign up The 10th IEEE Confer…

- 08-11 P** Sign up 2027 10th Internatio…

- 08-05 王** Sign up 2026 The 11th Intern…

- 07-31 刘** Sign up 2026 9th Internation…

- 07-23 s** Sign up 2026 the 7th Interna…

- 07-15 韩** Sign up 2026 The 11th Intern…

- 07-14 宁** Sign up 2026 IEEE 14th Inter…

- 07-10 梁** Sign up 2026 8th Internation…

- 07-02 邱** Sign up 2026 International C…

- 06-11 王** Sign up 2027 9th Internation…

- 05-28 汪** Sign up 2026 14th Internatio…

- 05-28 赵** Sign up 2026 the 7th Interna…

- 05-28 马** Sign up 2027 International C…

- 03-26 沈** Sign up 2027 International C…

- 03-26 吾** Sign up 2027 International C…





























































