Meetings: 37947
2027 6th International Conference on Materials Engineering and Functional Materials (ICMFM 2027)
2027-3-1 venue:VIETNAM
Full name: 2027 6th International Conference on Materials Engineering and Functional Materials (ICMFM 2027)
Abbreviation: ICMFM 2027
Conference Time: March 1-4, 2027
Conference Venue: Da Nang, Vietnam
ICMFM 2027 Shining Points:
1. Tour in Da Nang, Vietnam will be arranged on March 3 and 4, 2027.
2. The conference is organized by Duy Tan University, Vietnam.
Call for papers:
Topic 1: Materials Science and Engineering
Metallic Alloys, Tool Materials, Superplastic Materials, Ceramics and Glasses, Composites, Amorphous Materials, Nanomaterials, Biomaterials, Multifunctional Materials, Smart Materials, Engineering Polymers, Functional materials, Nuclear fuel materials, Biomaterials, sensors and surfaces, Thin Film Chalcogenide Photovoltaic Materials, Nuclear Materials IV, Magnetic Materials, Multi Functional Magnetic Materials, Superconducting Materials, Structured Materials, Spintronics Materials and Devices, Hard/Soft Magnetic Materials, Crosscutting materials
Topic 2: Materials Properties, Measuring Methods and Applications
Ductility, Crack Resistance, Fatigue, Creep-resistance, Fracture Mechanics, Mechanical Properties, Electrical Properties, and Magnetic Properties, Corrosion, Erosion, Wear Resistance, Non-Destructive Testing, Reliability Assessment, Toxicity, Working Properties of Materials and Products, Large Scale Applications, Electronics Applications
Topic 3: Nanotechnology and smart materials
Nanomaterial synthesis, characterization and metrology, Nanotechnology integration, Micro/Nano materials, Smart and intelligent materials, Intelligent materials systems, Polymeric materials.
Publication:
1. Submissions will be peer reviewed by conference program committees and international reviewers, accepted and presented papers will be included into Springer Proceedings in Materials, which will be submitted to EI Compendex, SCOPUS and SCImago databases for abstracting and indexing.
2.【Journal Recommendation】Advances in Natural Sciences: Nanoscience and Nanotechnology (ANSN) (ISSN 2043-6262)
We are pleased to recommend ANSN, a high-quality gold open access journal in the field. Published by IOP Publishing on behalf of the Vietnam Academy of Science and Technology (VAST), the journal charges no article publication fees (APCs) From 1st January 2025 if the thesis is subscription-access basis. It offers efficient peer review, with a median of 7 days to first decision before peer review and 47 days to first decision after peer review. The latest Impact Factor is 2.1 with CiteScore 3.3. The journal covers all aspects of nanoscience and nanotechnology, with recent highlights including nanomedicine, nanoelectronic devices, intelligent gas sensors, and photocatalytic materials.
Conference agenda:
March 1, 2027 (MON)
Sign in & Collect Conference materials
Technical Program
Opening Remarks
Keynote Speeches
Invited Speeches
Technical Sessions for Oral
March 2, 2027 (TUE)
Keynotes Speeches
Invited Speeches
Tracks and Special Sessions
Technical Sessions for Oral
Technical Sessions for Poster
March 3-4, 2027 (WED-THU)
Technical Program
Academic Visit & Excursion
Conference website
Abbreviation: ICMFM 2027
Conference Time: March 1-4, 2027
Conference Venue: Da Nang, Vietnam
ICMFM 2027 Shining Points:
1. Tour in Da Nang, Vietnam will be arranged on March 3 and 4, 2027.
2. The conference is organized by Duy Tan University, Vietnam.
Call for papers:
Topic 1: Materials Science and Engineering
Metallic Alloys, Tool Materials, Superplastic Materials, Ceramics and Glasses, Composites, Amorphous Materials, Nanomaterials, Biomaterials, Multifunctional Materials, Smart Materials, Engineering Polymers, Functional materials, Nuclear fuel materials, Biomaterials, sensors and surfaces, Thin Film Chalcogenide Photovoltaic Materials, Nuclear Materials IV, Magnetic Materials, Multi Functional Magnetic Materials, Superconducting Materials, Structured Materials, Spintronics Materials and Devices, Hard/Soft Magnetic Materials, Crosscutting materials
Topic 2: Materials Properties, Measuring Methods and Applications
Ductility, Crack Resistance, Fatigue, Creep-resistance, Fracture Mechanics, Mechanical Properties, Electrical Properties, and Magnetic Properties, Corrosion, Erosion, Wear Resistance, Non-Destructive Testing, Reliability Assessment, Toxicity, Working Properties of Materials and Products, Large Scale Applications, Electronics Applications
Topic 3: Nanotechnology and smart materials
Nanomaterial synthesis, characterization and metrology, Nanotechnology integration, Micro/Nano materials, Smart and intelligent materials, Intelligent materials systems, Polymeric materials.
Publication:
1. Submissions will be peer reviewed by conference program committees and international reviewers, accepted and presented papers will be included into Springer Proceedings in Materials, which will be submitted to EI Compendex, SCOPUS and SCImago databases for abstracting and indexing.
2.【Journal Recommendation】Advances in Natural Sciences: Nanoscience and Nanotechnology (ANSN) (ISSN 2043-6262)
We are pleased to recommend ANSN, a high-quality gold open access journal in the field. Published by IOP Publishing on behalf of the Vietnam Academy of Science and Technology (VAST), the journal charges no article publication fees (APCs) From 1st January 2025 if the thesis is subscription-access basis. It offers efficient peer review, with a median of 7 days to first decision before peer review and 47 days to first decision after peer review. The latest Impact Factor is 2.1 with CiteScore 3.3. The journal covers all aspects of nanoscience and nanotechnology, with recent highlights including nanomedicine, nanoelectronic devices, intelligent gas sensors, and photocatalytic materials.
Conference agenda:
March 1, 2027 (MON)
Sign in & Collect Conference materials
Technical Program
Opening Remarks
Keynote Speeches
Invited Speeches
Technical Sessions for Oral
March 2, 2027 (TUE)
Keynotes Speeches
Invited Speeches
Tracks and Special Sessions
Technical Sessions for Oral
Technical Sessions for Poster
March 3-4, 2027 (WED-THU)
Technical Program
Academic Visit & Excursion
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