Website URL: http://aemcse.org
Start Date / End Date: March 6-8, 2020
Location: Sanya, China
1.About the conference:
The 2020 3rd International Conference on Advanced Electronic Materials,
Computers and Software Engineering(AEMCSE 2020) will be held in Shenzhen, China
during March 6-8, 2020.
AEMCSE is an annual conference which explores the development and
implications in the related fields of Advanced Electronic Materials, Computers
and Software Engineering with an objective to present the novel and fundamental
advancements. It also serves to foster communication among researchers and
practitioners working in a wide variety of scientific areas with a common
interest in improving Advanced Electronic Materials, Computers and Software
Engineering. Featured with invited speeches and paper presentations, AEMCSE
2020 welcomes submission of researches concerning any branch of Advanced
Electronic Materials, Computers and Software Engineering.
2.Publication
All accepted papers of AEMCSE 2020 will be published in IOP Conference
Series: Materials Science and Engineering(MSE)(ISSN:1757-8981 EISSN:1757-899X),
and will be submitted to EI Compendex, Scopus for indexing.
3.Important Dates
Notification Date: 1-2 weeks after submission
Conference Date:March 6-8, 2020
4.Submission Guides
Requirement:
1) The manuscript should be written in accordance with the standard of
template.
2) All papers should be written in English with a mininum paper length of
4 pages and no longer than 12 pages.
3) All submitted articles should report original, previously unpublished
research results, experimental or theoretical.
4) Articles submitted to the Conference should meet these criteria and
must not be under consideration for publication elsewhere.
1) Full Paper (Presentation and Publication)
Accepted full papers will be invited to give the oral presentation at the
conference and be published in one of the Journals / conference proceeding.
2) Abstract (Presentation only)
Accepted abstract will be invited to give the oral presentation at the
conference, the presentation will not be published.
* Please submit your papers( word & pdf) to the E-mail address:
aemcse2020@163.com
5.Call For Papers
Key Words:
(I)
Advanced Electronic Materials
(II)
Computers
Engineering
(III) Software
Engineering
Other related topics (http://aemcme.org/a/Call_For_Papers/)
6.Registration
Regular Registration(4-6 pages) RMB2800/USD450
per paper
Additional Paper(4-6 pages) RMB2400/USD400
per paper
Extra Pages (Begin at Page 7) RMB300/USD50
per extra page
Attendees without Papers RMB1000/USD150
per person
7.Contact Us
Conference Secretary: Ms. Huang
E-mail:
aemcse2020@163.com
WeChat: 15819926753
QQ: 2152116918
Cellphone:
+86-18420103136
GSRA Website: http://gsrassn.org
-
The 7th International Conference 7167

-
2026 IEEE 18th International Con 5890

-
2026 the 9th International Confe 5856

-
The 4th International Conference 5708

-
2026 13th International Conferen 5492

-
2026 8th International Conferenc 5430

-
2026 11th International Conferen 5316

-
2026 the International Conferenc 5092

-
CMRAI 2026 5078

-
2026 The 11th International Conf 4725

-
2026 the 15th International Conf 709

-
The 7th International Conference 689

-
2026 the 6th International Sympo 589

-
2026 10th International Conferen 569

-
2026 the 11th International Conf 560

-
2026 14th International Conferen 536

-
2026 10th International Conferen 529

-
2026 16th International Conferen 528

-
2026 10th International Conferen 497

-
2026 the International Conferenc 489

- 02-09 魏** Sign up 2026 International C…

- 02-06 杨** Sign up 2026 7th Internation…

- 01-28 李** Sign up 2026 7th IEEE Intern…

- 01-26 陈** Sign up 2026 10th Internatio…

- 01-16 储** Sign up 2026 the 9th Interna…

- 01-15 姚** Sign up 2026 The 6th Interna…

- 01-04 谷** Sign up 2026 the 15th Intern…

- 12-22 吴** Sign up 2026 IEEE 2nd Intern…

- 12-17 袁** Sign up 2026 the 8th Interna…

- 12-11 杜** Sign up CMRAI 2026

- 11-28 M** Sign up 2026 The 12th Intern…

- 11-22 K** Sign up 2026 10th Asia-Pacif…

- 11-17 k** Sign up 2026 10th Internatio…

- 11-10 王** Sign up 2026 the 6th Interna…

- 11-07 S** Sign up 2026 The 6th Interna…

- 11-04 鲁** Sign up 2026 The 12th Intern…






























































