CONFERENCE INFORMATION:
Website:http://www.eei2020.org/
Conference Date:July 17-19, 2020
Venue:Lanzhou, China
Submission Deadline:July 15, 2020
Indexing:EI,Scopus,SCI
2019 International Conference on Electronic Engineering and Informatics (EEI 2019) was successfully held on November 8-10,2019 in Nanjing, China. Now the 2020 2nd International Conference on Electronic Engineering and Informatics (EEI 2020) will be held on July 17-19, 2020 in Lanzhou, China. EEI 2020 is to bring together innovative academics and industrial experts in the field of Electronic Engineering and Informatics to a common forum. The primary goal of the conference is to promote research and developmental activities in Electronic Engineering and Informatics and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in Electronic Engineering and Informatics and related areas.
1. Organizer
AEIC Academic Exchange Information Centre
Conference chair:
Prof.Ting Yang
School of Electrical and Information Engineering, Tianjin University
Keynote Speakers
![]() |
Prof. Ting Yang School of Electrical and Information Engineering, Tianjin University, China Research Area: Energy & Power, Internet of Things, Artificial Intelligence, Intelligent Manufacturing |
![]() |
Prof. Philip T Moore. School of Information Science and Enginering, Lanzhou University, China Research Area: Intelligent processing, Program, Intelligent Systems, Data structure development |
![]() |
Prof. Hiroshi Watanabe National Chiao Tung University/Dept. Electrical and Computer Engineering, Japan Research Area: Blockchained IoT, Electron device technology, Flash memory, Electronic Biosensing, Quantum computing, Quantum Physics |
2.CALL FOR PAPER
The topics of interest for submission include, but are not limited to:
1. Electronic Science and Technology
2. Integrated Circuit
3. Microelectronics and solid state electronics
4. Information and Communication Engineering
5. Computer Science and Technology
6. Digital signal processing
7. Image processing
8. Signal and system
9. Wireless multimedia communication
10. Electromagnetic field theory
11. Automatic control
12. Sensing technology
13. System engineering
14. Test system software hardware design
15. Information Theory and Coding
16. Information Processing
17. Information Resource Management
18. Information Security
19. Information Communication
20. Other related topics
3.Publication
*All accepted papers of EEI 2020 will be published in the CPS (Conference Publishing Services), which will be submitted to EI Compendex, Scopus, Inspec, CPCI (Web of Science)for indexing.
*High quality papers will be recommended for publication in SCI journal.
Journal 1:Computer communications(ISSN: 0140-3664, IF=2.766, special issue)
Journal 2:EURASIP Journal on Image and Video Processing(ISSN: 1687-5281, IF=1.534, regular issue)
Journal 3:Journal of Materials Science: Materials in Electronics(ISSN: 0957-4522, IF=2.195, regular issue)
All SCI submissions must not be less than 8 pages in length.
Please submit your origin papers to SCI Submission System and note "SCI-EEI".
P.S. Please do not submit your paper to both conference proceedings and SCI Journal.
4.Submission Methods
1.The submitted papers must not be under consideration elsewhere.
2.Please send the full paper(word+pdf) to SUBMISSION SYSTEM
3.Please submit the full paper, if presentation and publication are both needed.
4.Please submit the abstract only, if you just want to make presentations.
5.Should you have any questions, or you need any materials in English, please contact us at iciseei@163.com
5.Registration
For the publication on EEI 2020 conference proceedings:
|
Items |
Registration fee (By RMB) |
Registration fee (By US Dollar) |
|
Regular Registration(4 pages) |
3000RMB/per paper |
450 USD/per paper |
|
Additional Paper(4 pages) |
2800RMB/per paper |
430 USD/ per paper |
|
Extra Pages (Begin at Page5) |
300RMB/per extra page |
50 USD/ per extra page |
|
Attendees without Papers |
1200RMB/per person |
180 USD / per person |
|
Attendees without Papers (Groups) |
1000RMB/per person(≥ 3 persons) |
150 USD / per person(≥ 3 persons) |
|
Purchase Extra Journal |
500RMB/book |
75 USD/book |
6.Program
|
Schedule |
||
|
July 17,2020 |
13:00-17:00 |
Registration |
|
July 18,2020 |
09:00-12:00 |
Speeches of Keynote Speakers |
|
12:00-14:00 |
Lunch |
|
|
14:00-17:30 |
Oral Presentations |
|
|
18:00-19:30 |
Banquet |
|
|
July 19,2020 |
09:00-18:00 |
Academic Investigation |
7.CONTACT US
Conference Secretary:
E-mail: iciseei@163.comTel: +86-13902265879
Tel: +86-13902265879
WeChat:13902265879
QQ:2297104879

-
2026 13th International Conferen 8383

-
2026 8th International Conferenc 8322

-
The 7th International Conference 7726

-
The 4th International Conference 7649

-
2026 2nd International Conferenc 7534

-
2026 6th International Conferenc 7393

-
2026 12th International Conferen 7346

-
10th Asia-Pacific Conference on 7045

-
2026 IEEE 18th International Con 6453

-
2026 the 9th International Confe 6387

-
2026 the 15th International Conf 733

-
The 7th International Conference 716

-
2026 10th International Conferen 608

-
2026 the 6th International Sympo 602

-
2026 the 11th International Conf 601

-
2026 14th International Conferen 575

-
2026 10th International Conferen 565

-
2026 16th International Conferen 562

-
2026 10th International Conferen 539

-
2026 8th International Conferen 519

- 05-08 李** Sign up 2026 16th Internatio…

- 05-06 Y** Sign up 2026 International C…

- 05-06 w** Sign up 2026 International C…

- 05-05 闫** Sign up 2026 the 8th Interna…

- 05-04 H** Sign up 2026 The 9th Interna…

- 05-04 M** Sign up 2026 The 9th Interna…

- 05-04 陈** Sign up 2026 The 7th Interna…

- 04-20 张** Sign up 2026 IEEE 3rd Intern…

- 04-11 J** Sign up 2026 9th Internation…

- 04-09 刘** Sign up 2026 6th Internation…

- 04-08 王** Sign up 2026 International C…

- 04-03 魏** Sign up 2026 The 10th Intern…

- 03-26 沈** Sign up 2027 International C…

- 03-26 吾** Sign up 2026 5th Internation…

- 03-26 吾** Sign up 2027 International C…

- 03-18 张** Sign up 2026 4th Internation…






























































