CONFERENCE INFORMATION:
Website:https://ais.cn/u/MnyqAr
Conference Date:Apr. 23-25, 2021
Venue:Chengdu, China
Submission Deadline: April 19, 2021
Notification: within 1 week after submission
Indexing:EI,Scopus,CNKI
The 2021 International Conference on Sensing Technology and Applications(ICSTA 2021)will be held on April 23 to 25, 2021 in Chengdu China. The meeting focused on the research fields of "Sensing Technology" and "Sensing Applications". The aim is to provide a common forum for researchers, scientists, engineers and practitioners throughout the world to present their latest research findings, ideas, developments and applications in the area of sensing technology, to explore the development path of ecological civilization construction, and to cope with new opportunities and challenges.
We cordially invite you to submit paper and attend ICSTA 2021. Looking forward to your participation!
1.General Chair

Prof. Zhi Gao
Wuhan University
2.Keynote Speakers
Prof. Zhi Gao
Wuhan University, China
Prof. Bingguo Liu
Harbin Institute of Technology, China
Prof. Qingyang Wei
University of Science and Technology Beijing, China
Prof. Xinhua Tang
Southeast University, China
Prof. Yang Chai
The Hong Kong Polytechnic University, China
Keep updating…
3.CALL FOR PAPER
|
3D Printed Sensors |
|
Applications of Sensors (automotive, medical, environmental monitoring, consumer, alarm and security, military, nautical, aeronautical and space sensor systems, robotics, and automation) |
|
Biosensors |
|
Chemical & Biological Sensor System |
|
Electromagnetic Sensors |
|
Fabrication Technology |
|
Fiber Optic Sense Technology |
|
Health monitoring and fault diagnosis |
|
Human Activity Monitoring |
|
Imaging Sensors |
|
Immunosensors |
|
Lab-on chip |
|
Mechanical sensors (inertial, pressure, and tactile) |
|
Modeling and Simulation of Novel Devices |
|
Motion and Location Tracking |
|
Multi-sensor and Sensor-network Systems |
|
Nanomaterials and Electrics Technology for Sensors |
|
Optical Sensors (radiation sensors, optoelectronic/photonic sensors, and fibres) |
|
Physical Sensor System |
|
Polymer Materials for Sensors |
|
Pressure & Strain Sensors |
|
Semiconductor Materials for Sensors |
|
Sensor Modeling & Characterization |
|
Sensor Network and Application |
|
Sensors and Actuators |
|
Sensors Signal Processing |
|
Smart Sensors |
|
Structural Sensing |
|
Temperature,Humidity and Gas Sensors |
|
Theory and New Approach |
|
Ultrasonic, Acoustic, Magnetic Sensors |
|
Vision Sensing |
|
Wireless Sensors and WSN |
4.Publication
All papers, both invited and contributed, will be reviewed by two or three experts from the committees. All accepted full papers will be published in conference proceedings and will be submitted to EI Compendex, Scopus, CNKi for indexing.
5. Participation Types:
Package A: Only Attendance
Package B: Abstract Submission+Oral Presentation
Package C: Abstract Submission+Poster Presentation
Package D: Full Paper Publicaiton+Oral/Poster Presentation+Attendance
Note: If you need paper publication and presentation both, please submit full paper.
If you need to make presentation without publication, please submit abstract only.
Submission Methods
For Chinese native speakers,
If you choose Package D, please submit the full paper (word+pdf) to SUBMISSION SYSTEM
If you choose Package A, B or C, please register via REGISTRATION SYSTEM .
For English speakers,
Please send your full paper or abstract directly to: contact_icsta@163.com.
6.Registration Fee
|
Item |
Registration fee (By RMB) |
Registration fee (By US Dollar) |
|
Publication +Attendance |
3200RMB/per paper (4-6 pages) |
500 USD/per paper (4-6 pages) |
|
Manuscript numbers ≥ 3 |
2900RMB/per paper (4-6 pages)
|
450 USD/ per paper (4-6 pages) |
|
Extra Pages (Begin at Page 7) |
300RMB/per extra page |
50 USD/ per extra page |
|
Presentation+Attendance |
1500RMB/per person |
250USD/per person |
|
Attendance Only |
1200RMB/per person |
180 USD / per person |
|
Attendees without Submission (Groups) |
1000RMB/per person(≥ 3 persons) |
150 USD / per person(≥ 3 persons) |
7.Program
|
Date |
Time |
Activities |
|
4.23 (Friday) |
09: 00-18: 00 |
Registration |
|
4.24 (Saturday) |
08: 50-09: 00 |
Open Ceremony |
|
09: 00-12: 00 |
Keynote Speeches |
|
|
12: 00-14: 00 |
Lunch |
|
|
14: 00-18: 00 |
Oral Session |
|
|
4.25(Sunday) |
09:00-18:00 |
Academic Investigation |
* The detailed conference program will be released about one month before the conference
CONTACT US
Conference Secretary:Hailey Dong
E-mail: contact_icsta@163.com
Tel: +86-17320189207 (Wechat)
QQ: 2640905300

-
2026 13th International Conferen 8376

-
2026 8th International Conferenc 8317

-
The 7th International Conference 7697

-
The 4th International Conference 7639

-
2026 2nd International Conferenc 7526

-
2026 6th International Conferenc 7385

-
2026 12th International Conferen 7341

-
10th Asia-Pacific Conference on 7031

-
2026 IEEE 18th International Con 6430

-
2026 the 9th International Confe 6378

-
2026 the 15th International Conf 732

-
The 7th International Conference 716

-
2026 10th International Conferen 607

-
2026 the 6th International Sympo 602

-
2026 the 11th International Conf 598

-
2026 14th International Conferen 575

-
2026 10th International Conferen 564

-
2026 16th International Conferen 560

-
2026 10th International Conferen 537

-
2026 8th International Conferen 517

- 05-06 Y** Sign up 2026 International C…

- 05-06 w** Sign up 2026 International C…

- 05-05 闫** Sign up 2026 the 8th Interna…

- 05-04 H** Sign up 2026 The 9th Interna…

- 05-04 M** Sign up 2026 The 9th Interna…

- 05-04 陈** Sign up 2026 The 7th Interna…

- 04-20 张** Sign up 2026 IEEE 3rd Intern…

- 04-11 J** Sign up 2026 9th Internation…

- 04-09 刘** Sign up 2026 6th Internation…

- 04-08 王** Sign up 2026 International C…

- 04-03 魏** Sign up 2026 The 10th Intern…

- 03-26 沈** Sign up 2027 International C…

- 03-26 吾** Sign up 2026 5th Internation…

- 03-26 吾** Sign up 2027 International C…

- 03-18 张** Sign up 2026 4th Internation…

- 03-11 徐** Sign up 2026 12th Internatio…



























































