The 7th Int'l
Conference on Microwave and Terahertz Technology (ICMTT_D 2021)
Conference Date: December 24-26, 2021
Conference Venue: Sanya, China
Website: https://www.seminarjan.org/conference/ICMTT_D2021/
Online Registration:
https://www.seminarjan.org/RegistrationSubmission/default.aspx?ConferenceID=1437
Email Registration: conf_contact@163.com
The 7th Int'l Conference on Microwave
and Terahertz Technology (ICMTT_D 2021) will
be held in Sanya, China on December 24-26, 2021. This conference will
cover issues on microwave and terahertz technology. It
dedicates to creating a stage for exchanging the latest research results and
sharing the advanced research methods.
If you wish to serve the conference as an invited
speaker, please send email to us with your CV. We'll contact with you asap.
Publication and Presentation
Publication: All
the accepted papers will be published by a peer-reviewed open access journal
that can ensure the widest dissemination of your published work, for more
information, please contact us (conf_contact@163.com)
Index: CNKI and Google Scholar
Note: If you want to present your research results but do NOT wish to publish a
paper, you may simply submit an Abstract to our Registration System.
Contact Us
Email: conf_contact@163.com
(editor.rolinzhang@gmail.com)
Tel: +86 15527426990
QQ: 1349406763
WeChat: 3025797047
Twitter: conf_Committee
Attendance Methods
1. Submit Full Paper (Regular Attendance+Paper
Publication+Presentation)
You are welcome to submit full paper, all the accepted papers will be published
by Open access journal.
2. Submit Abstract (Regular Attendance+Abstract+Presentation)
3. Regular Attendance (No Submission Required)
Conference
Topics:
Microwave Field and Techniques
Field Analysis and Guided Waves
Frequency-Domain EM Analysis Techniques
Time-Domain EM Analysis Techniques
CAD Algorithms and Techniques
Linear Device Modeling
Nonlinear Device Modeling
Nonlinear Circuit and System Simulation
Microwave Passive Components
Transmission Line Elements
Passive Circuit Elements
Planar Passive Filters and Multiplexers
Non-planar Passive Filters and
Multiplexers
Active, Tunable and Integrated Filters
Ferroelectric, Ferrite and Acoustic Wave
Components
MEMS Components and Technologies
Microwave Active Components
Semiconductor Devices and Monolithic ICs
Signal Generation
Frequency Conversion and Control
HF, VHF and UHF Technologies and
Applications
Power Amplifier Devices and Circuits
High-Power Amplifiers
Low Noise Components and Receivers
Mm-Wave and THz Components and
Technologies
Microwave Systems and Applications
Microwave Photonics
Mixed Mode and Digital Signal Processing
Circuits and Systems
Packaging, Interconnects, MCMs and
Integration
Instrumentation and Measurement Techniques
Biological Effects and Medical
Applications
Arrays as Antennas and Power Combiners
Radar and Broadband Communication Systems
Wireless and Cellular Communication
Systems
Sensors and Sensor Systems
RFID Technologies
High Power Microwave Industrial Applications
Emerging Technical Areas of Microwave
RF Nanotechnology
Wireless Power Transmission
New Technologies and Applications
Innovative Systems
Microwave/RF Devices for Wireless Health Care
Applications
Terahertz Theory and Technology
Terahertz Devices:
Electronics/Photonics/Plasmonics
Terahertz Generation, Propagation, and
Interaction
Passive Components and Materials Issues in
Terahertz
Terahertz Imaging
Terahertz Sources, Detectors and Receivers
Terahertz System Architectures and Distributed
Networks
Terahertz Diagnostics
Terahertz Nanoelectronics
Terahertz Spectroscopy
Terahertz Systems
Advanced Materials and Concepts (E.G.,
Metamaterials, Memristor)
Novel Concepts (E.G., Plasmonic THz, Quantum
Cascade Lasers)
Terahertz to Optical Metamaterials, Assemblies,
and Systems
New Frontiers and Recent Breakthroughs in
Terahertz Research
Novel Applications of Terahertz
VLSI Trustworthiness and Inspection –
Counterfeit IC Detection
Industrial Inspection
Security and Military
Biomedical
Information Processing and Computing
Electronics/Information/Communication
Systems
Integration of Advanced Materials with
Conventional Devices and Systems
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