| The first International Academic Conference of Com 2014.11 北京市 |
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主办单位: |
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IEEE association of international academic exchanges |
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协办单位: |
| International Bauhaus Science Press |
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支持单位: |
| 《Circuit World》 《Soldering & Surface Mount Technology》 《Computer Modelling and New Technologies》 《International Journal of Computer Applications in Technology》 《Nanoscience and Nanotechnology Letters》 《Fratturaed Integrita Strutturale》 |
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承办单位: |
| Ningbo Bauhaus Creative Design and Cultural Planning CO., LTD |
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