Conference Title: 2022 International Conference on Mechanical, Aerospace Technology and Materials Application(MATMA 2022)
URL:http://www.ic-matma.org/
Start Date / End Date: September 23-25 2022
Location:Chengdu, China.
Submission Deadline: Visit the website for more details
1. About the conference:
2022 International Conference on Mechanical, Aerospace Technology and Materials Application will be held in Chengdu, China on September 23-25, 2022.
MATME 2022 will bring together innovative scholars and industry experts in the fields of Mechanical, Aerospace Technology and Materials Application to a common forum. The main goal of the conference is to promote research and development activities in the fields of Machinery, aerospace technology and material application. Another goal is to promote the exchange of scientific information among researchers, developers, engineers, students and practitioners around the world.Therefore, it promotes the development and application of theory and technology in this field in universities and enterprises, and also establishes business or research contacts for participants and seeks global partners in future careers.
Welcome to submit papers to MATMA 2022 to join in the conference. We are looking forward to seeing you in Chengdu, China!
2. Publication
Submit to Conference Proceedings (EI)
Papers submitted to MATMA 2022 will be reviewed by technical committees of the conference.
All accepted full papers will be published in Conference Proceedings and will be submitted to EI Compendex for indexing.
3. Submission Guides
A. Full Paper (for Presentation and Publication)
Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceedings.
B. Abstract (Presentation only)
Accepted abstract will be invited to give the oral presentation at the conference, the presentation will not be published.
C. English Template (download)
*All submissions must not be less than 4 pages in length.
(authors will be charged extra 40 USD/page if the manuscript length is more than 6 pages)
D. Submission Methods
Please send the full paper & abstract to AIS SUBMISSION SYSTEM.
4. Call for papers
Advanced Manufacturing |
Heat and Mass Transfer
|
5. Registration
Items |
Registration fee (By US Dollar) |
Regular Registration (4-6 pages) |
450 USD/per paper |
Additional Paper (4-6 pages) |
430 USD/ per paper |
Extra Pages (Begin at Page 7) |
50 USD/ per extra page |
Attendees without Papers |
180 USD / per person |
Attendees without Papers (Groups) |
150 USD / per person(≥ 5 persons) |
Purchase Extra Journal |
75 USD/book |
Contact Us
Conference Secretary: Chelsea Ye
Tel: +86-18122478740
WeChat: 86-18122478740
-
ICBDA 2020 3772
-
8th International Conference on 3607
-
2025 IEEE 5th International Conf 1927
-
2025 10th Asia Conference on Pow 1741
-
2024 6th International Conferenc 1664
-
2025 IEEE 6th International Conf 1336
-
2025 9th International Conferenc 1272
-
2025 2nd International Conferenc 1224
-
2025 International Conference on 1030
-
2025 2nd International Conferenc 972
-
ICBDA 2020 2474
-
2025 IEEE 5th International Conf 828
-
2025 Asian Conference on Applied 666
-
2025 IEEE 6th International Conf 655
-
2025 2nd International Conferenc 602
-
2025 Asia-Singapore Conference o 575
-
2025 6th International Conferenc 488
-
2025 11th International Conferen 485
-
2025 IEEE 6th International Conf 484
-
2025 Asia-Pacific Conference on 479
- 06-11 荀** Sign up 8th International Co…
- 06-04 w** Sign up The Second Internati…
- 05-29 肖** Sign up 2025 Asia-Pacific Co…
- 05-25 万** Sign up 2025 2nd Internation…
- 05-12 w** Sign up 2025 3rd Internation…
- 05-06 董** Sign up The Second Internati…
- 04-22 俞** Sign up 2025 IEEE 6th Intern…
- 04-15 杜** Sign up 8th International Co…
- 03-26 H** Sign up 2025 IEEE 6th Intern…
- 03-24 江** Sign up 2025 Asia-Singapore …
- 03-06 K** Sign up 2025 Asian Conferenc…
- 03-04 陆** Sign up 2025 Asian Conferenc…
- 02-27 黄** Sign up
- 02-10 忽** Sign up 8th International Co…
- 02-04 N** Sign up 2025 3rd Internation…
- 02-04 K** Sign up 2025 3rd Internation…