Full Name: 2026 9th International Conference on Materials Design and Applications (ICMDA 2026)

Abbreviation: ICMDA 2026

Conference Venue: Tohoku University, Sendai, Japan

Conference Date: April 17-20, 2026

Conference Website: https://www.icmda.org/

Publication:

Accepted and registered papers with presentation will be published in below listed journals of Scientific.Net collection.

Defect and Diffusion Forum (DDF) (ISSN print 1012-0386 / ISSN web 1662-9507)

Solid State Phenomena (SSP) (ISSN print 1012-0394 / ISSN web 1662-9779)

Materials Science Forum (MSF) (ISSN print 0255-5476 / ISSN web 1662-9752)

Key Engineering Materials (KEM) (ISSN print 1013-9826 / ISSN web 1662-9795)

Papers will be sent for indexing by Scopus, Inspec, Chemical Abstracts Service, Google Scholar etc.

History: 

ICMDA 2024: Vol. 1128. Materials Science Forum-ISBN: 978-3-0364-0681-7-Online Linkage | Indexed by Scopus

ICMDA 2023: Vol. 1099. Materials Science Forum-ISBN: 978-3-0364-0438-7-Online Linkage | Indexed by Scopus  

ICMDA 2022: Vol. 931. Key Engineering Materials-ISBN: 978-3-0357-2847-7-Online Linkage | Indexed by Scopus

ICMDA 2021: Vol. 324. Solid State Phenomena-ISBN: 978-3-0357-1859-1-Online Linkage | Indexed by Ei Compendex & Scopus

ICMDA 2020: Vol. 1009, Materials Science Forum-ISBN: 978-3-0357-1688-7-Online Linkage | Indexed by Ei Compendex & Scopus

ICMDA 2019: Vol. 972, Materials Science Forum-ISBN: 978-3-0357-1530-9-Online Linkage | Indexed by Ei Compendex & Scopus

ICMDA 2018: Vol. 937, Materials Science Forum-ISBN: 978-3-0357-1377-0-Online Linkage | Indexed by Ei Compendex & Scopus

Conference Committee:

Conference Chairs:

Osamu Tabata, Kyoto University of Advanced Science, Japan

Takashige Omatsu, Chiba University, Japan

Program Chairs:

Masahiro Nomura, The University of Tokyo, Japan

Kwang Leong Choy, Duke Kunshan University, China

Program Co-Chairs:

Yoshio Kobayashi, Ibaraki University, Japan

Anatoly Zinchenko, Nagoya University, Japan

......

More info about conference Committees: https://icmda.org/com.html

Submission Method: 

System Submission: https://confsys.iconf.org/submission/icmda2026

Email Submission: icmda@cbees.net

For more details, you can learn through: https://icmda.org/sub.html

Call for Paper: 

-Materials Properties, Measuring Methods and Applications

Creep-resistance

Fracture Mechanics

Mechanical Propertie

-Materials Analyses and Modeling

Electron Microscopy

Artificial Intelligence Methods

Computational Material Science

-Materials Science and Materials Processing Technology

Optical / Electrical / Magnetic Materials

Environmental-Friendly Materials

Surface Engineering / Coatings Technology

For more topics, please visit: http://www.icmda.org/cfp.html