Full Name: 2026 9th International Conference on Materials Design and Applications (ICMDA 2026)
Abbreviation: ICMDA 2026
Conference Venue: Tohoku University, Sendai, Japan
Conference Date: April 17-20, 2026
Conference Website: https://www.icmda.org/
Publication:
Accepted and registered papers with presentation will be published in below listed journals of Scientific.Net collection.
Defect and Diffusion Forum (DDF) (ISSN print 1012-0386 / ISSN web 1662-9507)
Solid State Phenomena (SSP) (ISSN print 1012-0394 / ISSN web 1662-9779)
Materials Science Forum (MSF) (ISSN print 0255-5476 / ISSN web 1662-9752)
Key Engineering Materials (KEM) (ISSN print 1013-9826 / ISSN web 1662-9795)
Papers will be sent for indexing by Scopus, Inspec, Chemical Abstracts Service, Google Scholar etc.
History:
ICMDA 2024: Vol. 1128. Materials Science Forum-ISBN: 978-3-0364-0681-7-Online Linkage | Indexed by Scopus
ICMDA 2023: Vol. 1099. Materials Science Forum-ISBN: 978-3-0364-0438-7-Online Linkage | Indexed by Scopus
ICMDA 2022: Vol. 931. Key Engineering Materials-ISBN: 978-3-0357-2847-7-Online Linkage | Indexed by Scopus
ICMDA 2021: Vol. 324. Solid State Phenomena-ISBN: 978-3-0357-1859-1-Online Linkage | Indexed by Ei Compendex & Scopus
ICMDA 2020: Vol. 1009, Materials Science Forum-ISBN: 978-3-0357-1688-7-Online Linkage | Indexed by Ei Compendex & Scopus
ICMDA 2019: Vol. 972, Materials Science Forum-ISBN: 978-3-0357-1530-9-Online Linkage | Indexed by Ei Compendex & Scopus
ICMDA 2018: Vol. 937, Materials Science Forum-ISBN: 978-3-0357-1377-0-Online Linkage | Indexed by Ei Compendex & Scopus
Conference Committee:
Conference Chairs:
Osamu Tabata, Kyoto University of Advanced Science, Japan
Takashige Omatsu, Chiba University, Japan
Program Chairs:
Masahiro Nomura, The University of Tokyo, Japan
Kwang Leong Choy, Duke Kunshan University, China
Program Co-Chairs:
Yoshio Kobayashi, Ibaraki University, Japan
Anatoly Zinchenko, Nagoya University, Japan
......
More info about conference Committees: https://icmda.org/com.html
Submission Method:
System Submission: https://confsys.iconf.org/submission/icmda2026
Email Submission: icmda@cbees.net
For more details, you can learn through: https://icmda.org/sub.html
Call for Paper:
-Materials Properties, Measuring Methods and Applications
Creep-resistance
Fracture Mechanics
Mechanical Propertie
-Materials Analyses and Modeling
Electron Microscopy
Artificial Intelligence Methods
Computational Material Science
-Materials Science and Materials Processing Technology
Optical / Electrical / Magnetic Materials
Environmental-Friendly Materials
Surface Engineering / Coatings Technology
For more topics, please visit: http://www.icmda.org/cfp.html
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