Full name: 2026 The 11th International Conference on Integrated Circuits and Microsystems (ICICM 2026)

Abbreviation: ICICM 2026

Place: Xi'an, China

Time: October 23-25, 2026

Website: http://icicm.net/

Co-Sponsored by: 

Xi'an Jiaotong University

Southeast University

University of Electronic Science and Technology of China

Hosted by: 

Xi'an Jiaotong University

Special Awards for Encouragement: 

Young Scientist Award

Best Paper Award

Best Student Paper Award

Best Organization Award, etc.

Submission:

1. Full Paper with at least 4 full pages (Presentation and Publication)

Template Download in Word: https://www.icicm.net/files/Template.doc

Template Download in Latex: https://www.icicm.net/files/IEEE-conference-proceeding-Latex.rar

2. Abstract within 300-500 words (Presentation only)

All manuscripts must be written in English.

Electronic submission system: https://easychair.org/conferences/?conf=icicm2026

Email submission: icicm_conf@vip.163.com 

More detail about submission, please visit at http://icicm.net/submission.html

Publication:

Submitted papers will be Peer-Reviewed (Double Blind) and the accepted ones will be collected in the IEEE conference proceedings, included in IEEE Xplore and indexed by EI Compendex and Scopus.

ICICM 2016-2024 (previous 9 years) have been successfully indexed by EI Compendex and Scopus already!

Topics (include but not limit):

Track 1: Electronic Design Automation (EDA)

Progress of EDA algorithms

EDA for emerging technologies

Hardware-software co-design with EDA

EDA in High Performance Computing (HPC)

EDA in analog and mixed-signal design

Track 2: Integrated Circuit and System Design

Digital, analog, mixed-signal IC and SOC design technology

IC computer-aided design technology, DFM

Modeling and simulation

Track 3: Semiconductor Devices and Circuits

Components and circuits for wireless systems

Low power, RF devices and circuits

Silicon/Germanium Devices and Device Physics

Compound semiconductor devices and circuits

Track 4: Process Technology and Manufacturing

Silicon integrated circuits and manufacturing

Interconnect, low-K, high-K and other process technologies

Packaging and testing technology, equipment technology

For more topics, please visit at: http://icicm.net/call-for-papers.html

Organizing Committee:

Conference Chairs:

Zhigong Wang, Southeast University, China

Xiulong Wu, Anhui University, China

Kaixue Ma, Tianjin University, China

Conference Co-Chairs:

Ning Xu, Wuhan University of Technology, China

Xiaoqing Wen, Kyushu Institute of Technology, Japan 

Qiang Li, University of Electronic Science and Technology of China, China

Program Chairs:

Abdel-Hamid Ali Soliman, Staffordshire University, UK

Jun Han, Fudan University, China

Xiaopeng Yu, Zhejiang University, China

Meng Zhang, Southeast University, China

Sheng Chang, Wuhan University, China

Yingmei Chen, Southeast University, China

Zhikuang Cai, Nanjing University of Posts and Telecommunications, China

Zhuo Zou, Fudan University, China (IEEE Senior Member)

Jianguo Hu, Sun Yat-sen University , China

Bei Yu, The Chinese University of Hong Kong , China

Program Co-Chairs:

Junyong Deng, Xi'an University of Posts & Telecommunications, China

Jun Xu, Nanjing University, China

Zhixiong Di, Southwest Jiaotong University, China

Guojie Luo, Peking University, China

Xiaojun Zhai, University of Essex,  UK

Wei Xing, The University of Sheffield, UK

Program Committee:

Bo Liu, Southeast University, China 

Shi Pu, Wuhan University of Technology , China

Haizhi Song, University Of Electronic Science And Technology Of China, China

Lu Zhu, Sun Yat-sen University, China

Youming Zhang, Southeast University, China

Jianshi Tang, Tsinghua University, China

Weiguang Sheng, Shanghai Jiao Tong University, China

Hao Gao, Austria & Eindhoven University of Technology, The Netherland

Yun Fang, Silicon Austria Labs, Austria

Jeff Kilby, Auckland University of Technology, New Zealand

Zhijun Zhou, Southeast University, China

Xingyuan Tong, Xi`an University Of Posts & Telecommunications, China

Wei Hu, Northwestern Polytechnical University, China

Zhaori Bi, Fudan University, China

Zhengfeng Huang, Hefei University of Technology, China

Local Chair:

Lin Cheng, University of Science and Technology of China

Student Program Chairs:

Hongbin Sun, Xi'an Jiaotong University, China

Keping Wang, Tianjin University, China

Delong Shang, Institute of Microelectronics of the Chinese Academy of Sciences, China

Fanyi Meng, Tianjin University, China

Student Program Committee:

Li Du, Nanjing University, China

Lei Wang, Nanjing University Of Posts And Telecommunications, China

Xianbo Li, Sun Yat-sen University, China

Tiehu Li, Chongqing University of Technology, China

Moufu Kong, University of Electronic Science and Technology of China, China

Jiaxin Liu, University of Electronic Science and Technology of China, China

Maliang Liu, Xidian University, China

Xu Meng, Hefei University of Technology, China

Tianming Ni, Anhui University of Engineering, China

Qiang Zhao, Anhui University, China

More Organizing Committee list, please visit: https://icicm.net/committee.html

History:

ICICM2016 | Chengdu on November 23-25, 2016

ICICM2017 | Nanjing on November 8-11, 2017

ICICM2018 | Shanghai on November 24-26, 2018

ICICM2019 | Beijing on October 25-27,2019

ICICM2020 | Nanjing on October 23-25, 2020

ICICM2021 | Nanjing on October 22-24, 2021

ICICM2022 | Xi'an on October 28-31, 2022

ICICM2023 | Nanjing on October 20-23, 2023

ICICM2024 | Wuhan on October 25-27, 2024

ICICM2025 | Hefei on October 17-19, 2025