Full name: 2026 The 11th International Conference on Integrated Circuits and Microsystems (ICICM 2026)
Abbreviation: ICICM 2026
Place: Xi'an, China
Time: October 16-18, 2026
Website: http://icicm.net/
Co-Sponsored by:
Xi'an Jiaotong University
Southeast University
University of Electronic Science and Technology of China
Hosted by:
Xi'an Jiaotong University
Special Awards for Encouragement:
Young Scientist Award
Best Paper Award
Best Student Paper Award
Best Organization Award, etc.
Keynote Speakers
Keynote Speaker I
Prof. Ke Wu
Fellow of the Royal Society of Canada (RSC), Fellow of the Canadian Academy of Engineering (CAE), IEEE Fellow
University of Montreal, Canada
Keynote Speaker II
Prof. Wei Wang
Boya Distinguished Professor
Peking University, China
Keynote Speaker III
Prof. Hongbin Sun
Full Professor, Institute of Artificial Intelligence and Robotics
Xi'an Jiaotong University, China
Keynote Speaker IV
Prof. Yang Hu
Associate Professor, School of Integrated Circuits
Tsinghua University, China
Publication:
Submitted papers will be Peer-Reviewed (Double Blind) and the accepted ones will be collected in the IEEE conference proceedings, included in IEEE Xplore and indexed by EI Compendex and Scopus.
ICICM2016-2025 (previous 10 years) have been successfully indexed by EI Compendex and Scopus already!
Topics (include but not limit)
Track 1: Electronic Design Automation (EDA)
Progress of EDA algorithms
EDA for emerging technologies
Hardware-software co-design with EDA
EDA in High Performance Computing (HPC)
EDA in analog and mixed-signal design
Track 2: Integrated Circuit and System Design
Digital, analog, mixed-signal IC and SOC design technology
IC computer-aided design technology, DFM
Modeling and simulation
Track 3: Semiconductor Devices and Circuits
Components and circuits for wireless systems
Low power, RF devices and circuits
Silicon/Germanium Devices and Device Physics
Compound semiconductor devices and circuits
Track 4: Process Technology and Manufacturing
Silicon integrated circuits and manufacturing
Interconnect, low-K, high-K and other process technologies
Packaging and testing technology, equipment technology
Organizing Committee
Conference Chairs
Zhigong Wang, Southeast University, China
Xiulong Wu, Anhui University, China
Kaixue Ma, Tianjin University, China
Conference Co-Chairs
Ning Xu, Wuhan University of Technology, China
Xiaoqing Wen, Kyushu Institute of Technology, Japan
Qiang Li, University of Electronic Science and Technology of China, China
Program Chairs
Abdel-Hamid Ali Soliman, Staffordshire University, UK
Jun Han, Fudan University, China
Xiaopeng Yu, Zhejiang University, China
Meng Zhang, Southeast University, China
Sheng Chang, Wuhan University, China
Yingmei Chen, Southeast University, China
Zhikuang Cai, Nanjing University of Posts and Telecommunications, China
Zhuo Zou, Fudan University, China (IEEE Senior Member)
Jianguo Hu, Sun Yat-sen University , China
Bei Yu, The Chinese University of Hong Kong , China
Program Co-Chairs
Junyong Deng, Xi'an University of Posts & Telecommunications, China
Jun Xu, Nanjing University, China
Zhixiong Di, Southwest Jiaotong University, China
Guojie Luo, Peking University, China
Xiaojun Zhai, University of Essex, UK
Wei Xing, The University of Sheffield, UK
Program Committee
Bo Liu, Southeast University, China
Shi Pu, Wuhan University of Technology , China
Haizhi Song, University Of Electronic Science And Technology Of China, China
Lu Zhu, Sun Yat-sen University, China
Youming Zhang, Southeast University, China
Jianshi Tang, Tsinghua University, China
Weiguang Sheng, Shanghai Jiao Tong University, China
Hao Gao, Austria & Eindhoven University of Technology, The Netherland
Yun Fang, Silicon Austria Labs, Austria
Jeff Kilby, Auckland University of Technology, New Zealand
Zhijun Zhou, Southeast University, China
Xingyuan Tong, Xi`an University Of Posts & Telecommunications, China
Wei Hu, Northwestern Polytechnical University, China
Zhaori Bi, Fudan University, China
Zhengfeng Huang, Hefei University of Technology, China
Local Chair
Lin Cheng, University of Science and Technology of China
Student Program Chairs
Hongbin Sun, Xi'an Jiaotong University, China
Keping Wang, Tianjin University, China
Delong Shang, Institute of Microelectronics of the Chinese Academy of Sciences, China
Fanyi Meng, Tianjin University, China
Student Program Committee
Li Du, Nanjing University, China
Lei Wang, Nanjing University Of Posts And Telecommunications, China
Xianbo Li, Sun Yat-sen University, China
Tiehu Li, Chongqing University of Technology, China
Moufu Kong, University of Electronic Science and Technology of China, China
Jiaxin Liu, University of Electronic Science and Technology of China, China
Maliang Liu, Xidian University, China
Xu Meng, Hefei University of Technology, China
Tianming Ni, Anhui University of Engineering, China
Qiang Zhao, Anhui University, China
History
ICICM2016 | Chengdu on November 23-25, 2016
ICICM2017 | Nanjing on November 8-11, 2017
ICICM2018 | Shanghai on November 24-26, 2018
ICICM2019 | Beijing on October 25-27, 2019
ICICM2020 | Nanjing on October 23-25, 2020
ICICM2021 | Nanjing on October 22-24, 2021
ICICM2022 | Xi'an on October 28-31, 2022
ICICM2023 | Nanjing on October 20-23, 2023
ICICM2024 | Wuhan on October 25-27, 2024
ICICM2025 | Hefei on October 17-19, 2025
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