Full Name: 2026 6th International Conference on Circuits, Systems and Devices (ICCSD 2026)

Abbreviation: ICCSD 2026

Website: https://iccsd.net/

Venue: Ningbo, China

Dates: November 13-15, 2026

Conference Awards:

Young Scientist Award

Best Student Paper Award

Outstanding Organization Award

Best Oral Presentation Award

Best Poster Presentation Award

Outstanding Reviewer Awards

Proceedings:

All papers submitted to ICCSD that fall within its technical scope will be published in the Conference Proceedings, and at least one author of each accepted paper is expected to present at the conference.

ICCSD 2021: Online ISSN: 1742-6596. online, indexed by Ei Compendex & Scopus.

ICCSD 2020: Online ISSN: 1742-6596. online, indexed by Ei Compendex & Scopus.

ICCSD 2019: ISBN: 978-1-7281-3062-0. IEEE Xplore, indexed by Ei Compendex & Scopus.

ICCSD 2018: ISBN: 978-1-5386-8311-8. IEEE Xplore, indexed by Ei Compendex & Scopus.

ICCSD 2017: ISBN: 978-1-5386-1870-7. IEEE Xplore, indexed by Ei Compendex & Scopus.

Call for Papers:

Track 1: Microelectronic Devices

Advanced Transistors（GAAFETs/ VSAFETs）

Wide Bandgap Semiconductor Devices

Quantum Devices

Compound Semiconductor Devices

Spintronic Devices

Track 2: Power Devices and Power Management

Insulated-Gate Bipolar Transistor (IGBT)

Power MOSFET

Silicon Carbide（SiC）

Nano Energy Devices

Energy Conversion Devices

Energy Harvesting Technology

DC-DC Converter

Power Management & Energy Efficient Technology

Track 3: Sensors and Displays

Bio/Gas/Thermal/Voltage/Current Sensors

Vision Intelligence & Image Sensors

Acoustic Sensors

Display Technology & Devices

Photoelectric Conversion & Optical Fiber Sensing

Track 4: Electromagnetics & Microwave Devices

Power Amplifiers

Mixer & Microwave Sources

Terahertz Devices

Magnetic Devices

Electromagnetic Components

Antenna Design

Terahertz Sensing and Imaging

Computational Electromagnetics

Track 5: 3D Integration & Microsystems

System in Package（SiP）

Through Glass Via & Through Silicon Via

3D Integration Technology

High Density Packaging

CAD Tools for Packing

Microelectromechanical Systems

Photoelectric Fusion Module

Chiplets Based Microsystems

Wafer-Scale Integration & System on Wafer

Track 6: Digital Devices & VLSI Physical Design

Nonvolatile Memory

Computing in Memory

Emerging Memory Technologies

Clock Generator and Management

Physical Modeling for VLSI Design

Placement & Routing Algorithm

Evaluation Methods for VLSI Reliability

Aging Prediction & Mitigation

more details: https://iccsd.net/cfp.html

Call for Special Session:

Special Sessions may address one or more Tracks, but they should be Organized under a unified theme. Special Sessions are intended to allow projects or any other group of authors to present their own work. It is not expected that open calls for papers are launched for Special Sessions, in order to attract authors or presenters.

Special Sessions will be evaluated according to the following criteria:

– Relevance

– Timeliness

– Technical content

– Novelty

– Overall Recommendation

more details: https://iccsd.net/ss.html

Submission:

Make a submission: https://www.zmeeting.org/submission/iccsd2026

more details: https://iccsd.net/submission.html