Full Name: 2026 6th International Conference on Circuits, Systems and Devices (ICCSD 2026)
Abbreviation: ICCSD 2026
Website: https://iccsd.net/
Venue: Ningbo, China
Dates: November 13-15, 2026
Conference Awards:
Young Scientist Award
Best Student Paper Award
Outstanding Organization Award
Best Oral Presentation Award
Best Poster Presentation Award
Outstanding Reviewer Awards
Proceedings:
All papers submitted to ICCSD that fall within its technical scope will be published in the Conference Proceedings, and at least one author of each accepted paper is expected to present at the conference.
ICCSD 2021: Online ISSN: 1742-6596. online, indexed by Ei Compendex & Scopus.
ICCSD 2020: Online ISSN: 1742-6596. online, indexed by Ei Compendex & Scopus.
ICCSD 2019: ISBN: 978-1-7281-3062-0. IEEE Xplore, indexed by Ei Compendex & Scopus.
ICCSD 2018: ISBN: 978-1-5386-8311-8. IEEE Xplore, indexed by Ei Compendex & Scopus.
ICCSD 2017: ISBN: 978-1-5386-1870-7. IEEE Xplore, indexed by Ei Compendex & Scopus.
Call for Papers:
Track 1: Microelectronic Devices
Advanced Transistors（GAAFETs/ VSAFETs）
Wide Bandgap Semiconductor Devices
Quantum Devices
Compound Semiconductor Devices
Spintronic Devices
Track 2: Power Devices and Power Management
Insulated-Gate Bipolar Transistor (IGBT)
Power MOSFET
Silicon Carbide（SiC）
Nano Energy Devices
Energy Conversion Devices
Energy Harvesting Technology
DC-DC Converter
Power Management & Energy Efficient Technology
Track 3: Sensors and Displays
Bio/Gas/Thermal/Voltage/Current Sensors
Vision Intelligence & Image Sensors
Acoustic Sensors
Display Technology & Devices
Photoelectric Conversion & Optical Fiber Sensing
Track 4: Electromagnetics & Microwave Devices
Power Amplifiers
Mixer & Microwave Sources
Terahertz Devices
Magnetic Devices
Electromagnetic Components
Antenna Design
Terahertz Sensing and Imaging
Computational Electromagnetics
Track 5: 3D Integration & Microsystems
System in Package（SiP）
Through Glass Via & Through Silicon Via
3D Integration Technology
High Density Packaging
CAD Tools for Packing
Microelectromechanical Systems
Photoelectric Fusion Module
Chiplets Based Microsystems
Wafer-Scale Integration & System on Wafer
Track 6: Digital Devices & VLSI Physical Design
Nonvolatile Memory
Computing in Memory
Emerging Memory Technologies
Clock Generator and Management
Physical Modeling for VLSI Design
Placement & Routing Algorithm
Evaluation Methods for VLSI Reliability
Aging Prediction & Mitigation
more details: https://iccsd.net/cfp.html
Call for Special Session:
Special Sessions may address one or more Tracks, but they should be Organized under a unified theme. Special Sessions are intended to allow projects or any other group of authors to present their own work. It is not expected that open calls for papers are launched for Special Sessions, in order to attract authors or presenters.
Special Sessions will be evaluated according to the following criteria:
– Relevance
– Timeliness
– Technical content
– Novelty
– Overall Recommendation
more details: https://iccsd.net/ss.html
Submission:
Make a submission: https://www.zmeeting.org/submission/iccsd2026
more details: https://iccsd.net/submission.html
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