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CONFERENCE INFORMATION:
Website:http://www.confecie.org/
Conference Date:January 22-24, 2021
Venue:Zhengzhou, China
Submission Deadline: Nov. 27, 2020
Indexing:EI Compendex/ Scopus
International Conference on Electronics, Circuits and information Engineering(ECIE 2021)will be held on January 22-24 in Zhengzhou, China.
ECIE2021 is an international forum for scientists, engineers, and practitioners to present their latest research and development results in all areas of Electronics, Circuits and information Engineering. Conference topics mainly include, but not are limited to Digital electronics, Analogue Electronics, Microelectronics, Circuit design, Integrated circuits, Optoelectronics, Semiconductor devices, Embedded systems and Information Engineering etc. ECIE 2021 welcome all high-quality research papers and presentations from related research fields.
1. Organizer
Co-Organizer
2. Guest structure
Conference Chair
Prof. Farhad Shahnia Murdoch University |
|
International Organising Committees
Prof. Kamal Kumar Sharma, Lovely Professional University, Punjab
Dr. Kaichen XU, Osaka Prefecture University, Japan
Prof. Taraprasanna Dash, Siksha 'O' Anusandhan, India
Prof. M.Hassaballah, South Valley University, Egypt
Dr. Michal Hodoň, University of Zilina, Slovakia
Dr. Michael Waltl, Vienna University of Technology, Austria
Dr. Prabhat Ranjan, Manipal University Jaipur, India
Dr. Liviu Octavian Mafteiu-Scai, West University of Timisoara, Romania
Dr. Viktor Sverdlov, Vienna University of Technology, Austria
Prof. Yanfeng Jiang, Jiangnan University, China
Prof. Pascal Lorenz, University of Haute Alsace, France
Dr. Shahrizal Jelani, UCSI University, Malaysia
Dr. Farzin Shama, Islamic Azad University, Iran
Dr. S.A. Edalatpanah, University of Guilan, Iran
Dr. Froilan Mobo, Philippine Merchant Marine Academy, Philippines
Prof. S. Rajesh, Mepco Schlenk Engineering College, Sivakasi
Prof. Ang Chun Kit, UCSI University, Malaysia
Prof. Dariusz Jacek Jakobczak, Koszalin University of Technology, Poland
Dr. Anand Nayyar, Duy Tan University, Vietnam
Dr. Malka N. Halgamuge, The University of Melbourne, Australia
Dr. Kar Heng Lee, TBSS CENTER FOR ELECTRICAL AND ELECTRONICS ENGINEERING, Singapore
Dr. Ajay B Gadicha, Sant Gadge Baba Amravati University, Amravati, India
Dr. Sérgio Ivan Lopes, Instituto Politécnico de Viana do Castelo, Portugal
Keynote speaker
Prof. Farhad Shahnia Prof. Pham The Bao Prof. Yanchao Mao
Murdoch University Saigon University Zhengzhou University
Australia Viet Nam China
Dr. Anand Nayyar Prof. Panagiotis Papadimitriou
Duy Tan university University of Macedonia
Viet Nam Greece
Keep updating
3.CALL FOR PAPER
The topics of interest for submission include, but are not limited to:
Digital electronics
Analogue electronics
Microelectronics
Integrated circuits
Optoelectronics
Embedded systems
Analog Circuits and Signal Processing
Bioengineering Circuits and Systems
Biomedical Circuits and Systems
Circuit & System Design
Circuits and Systems for Communications
Circuit Simulation & Modeling
Semiconductor Devices and Circuits
Digital Circuits and Signal Processing
Device Simulation & Modeling
Digital Communications
Electronic Design Automation
Integrated Circuit and System Design
Low-Power and Harvesting Techniques
Low-Power, RF Devices & Circuits
Linear & Nonlinear Circuits and Systems
Multimedia Systems and Signal Processing
Neural Network Circuits and Systems
Nanoelectronic Circuits
Photonic and Optoelectronic Circuits
Power and Energy Circuits and Systems
Power Electronics and Applications
RF and Wireless Circuits and Systems
Sensing and Sensor Networks
Test and Reliability
VLSI Systems, Applications and Computer Aided Network Design
Emerging Technologies
Information and Communication Engineering
Artificial Intelligence
Bioinformatics
Software Engineering
VLSI Design and Fabrication
Photonic Technologies
Parallel and Distributed Computing
Data Mining
Cryptography
Algorithms and Data Structures
Graphs and Combinatorics
E-commerce and E-learning
Geographical Information Systems (GIS)
Networking
Signal Processing
Embedded System
Communication and Wireless Systems
Multimedia Systems and Applications
Emerging Technologies
Blockchain
Internet of Things
4.Publication
*All papers, both invited and contributed,
will be reviewed by two or three experts from the committees. After peer-review, all accepted papers of ISAIMS 2020 will be published by conference proceedings, and then submit to EI Compendex, Scopus for retrieval.
*High quality papers will be recommended for publication in SCI journal.
5. Participation Types:
Package A: Only Attendance
Package B: Abstract Submission+Oral Presentation
Package C: Abstract Submission+Poster Presentation
Package D: Full Paper Publicaiton+Oral/Poster Presentation +Attendance
Note: If you need paper publication and presentation both, please submit full paper.
If you need to make presentation without publication, please submit abstract only.
Submission Methods:
If you choose Package D, please submit the full paper (word+pdf) to SUBMISSION SYSTEM
If you choose Package A, B or C, please register via REGISTRATION SYSTEM .
6.Registration Fee
Item |
Registration fee (By RMB) |
Registration fee (By US Dollar) |
Publication+Presentation+Attendance |
3000RMB/per paper (4 pages) |
450 USD/per paper (4 pages) |
Additional Paper Publication |
2800RMB/per paper (4 pages) |
430 USD/ per paper (4 pages) |
Extra Pages (Begin at Page 5) |
300RMB/per extra page |
50 USD/ per extra page |
Presentation+Attendance |
1500RMB/per person |
250USD/per person |
Attendance Only |
1200RMB/per person |
180 USD / per person |
Attendees without Submission (Groups) |
1000RMB/per person(≥ 3 persons) |
150 USD / per person(≥ 3 persons) |
7.Program
Schedule |
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Date |
Time |
Activities |
Jan. 22(Friday) |
13:00-17:00 |
Registration |
Jan. 23(Saturday) |
09:00-12:00 |
Keynote Session |
12:00-14:00 |
Lunch |
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14:00-18:00 |
Invited Session |
|
18:00-19:30 |
Dinner |
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Jan. 24(Sunday) |
09:00-18:00 |
Technical Session |
CONTACT US
Conference Secretary: Leah Li
E-mail: contactecie@163.com
Tel: +86 17737319063 (Wechat)
QQ: 978640953
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