ICCSD 2026

Full Name: 2026 6th International Conference on Circuits, Systems and Devices (ICCSD 2026)

Abbreviation: ICCSD 2026

Website: https://iccsd.net/

Venue: Ningbo, China

Dates: November 13-15, 2026

Conference Awards 
Young Scientist Award
Best Student Paper Award
Outstanding Organization Award
Best Oral Presentation Award
Best Poster Presentation Award
Outstanding Reviewer Awards

Proceedings: 
After a careful reviewing process, all accepted papers after proper registration and presentation, will be published by IEEE Conference Proceedings, which will be included in IEEE Xplore, and submitted for indexing of Ei Compendex & Scopus after conference.

ICCSD 2021: Online ISSN: 1742-6596. online, indexed by Ei Compendex & Scopus.
ICCSD 2020: Online ISSN: 1742-6596. online, indexed by Ei Compendex & Scopus.
ICCSD 2019: ISBN: 978-1-7281-3062-0. IEEE Xplore, indexed by Ei Compendex & Scopus.
ICCSD 2018: ISBN: 978-1-5386-8311-8. IEEE Xplore, indexed by Ei Compendex & Scopus.
ICCSD 2017: ISBN: 978-1-5386-1870-7. IEEE Xplore, indexed by Ei Compendex & Scopus.

Call for Papers 
Track 1: Microelectronic Devices
Advanced Transistors（GAAFETs/ VSAFETs）
Wide Bandgap Semiconductor Devices
Quantum Devices
Compound Semiconductor Devices
Spintronic Devices

Track 2: Power Devices and Power Management
Insulated-Gate Bipolar Transistor (IGBT)
Power MOSFET
Silicon Carbide（SiC）
Nano Energy Devices
Energy Conversion Devices
Energy Harvesting Technology
DC-DC Converter
Power Management & Energy Efficient Technology

Track 3: Sensors and Displays
Bio/Gas/Thermal/Voltage/Current Sensors
Vision Intelligence & Image Sensors
Acoustic Sensors
Display Technology & Devices
Photoelectric Conversion & Optical Fiber Sensing

Track 4: Electromagnetics & Microwave Devices
Power Amplifiers
Mixer & Microwave Sources
Terahertz Devices
Magnetic Devices
Electromagnetic Components
Antenna Design
Terahertz Sensing and Imaging
Computational Electromagnetics

Track 5: 3D Integration & Microsystems
System in Package（SiP）
Through Glass Via & Through Silicon Via
3D Integration Technology
High Density Packaging
CAD Tools for Packing
Microelectromechanical Systems
Photoelectric Fusion Module
Chiplets Based Microsystems
Wafer-Scale Integration & System on Wafer

Track 6:  Digital VLSI and Memory Systems
Low-Power Digital Circuits
Memory Devices and Circuit Design
In-Memory Computing Architectures
AI and Machine Learning Hardware
SoC and 3D Heterogeneous Integration
Hardware Security for VLSI Systems
Emerging Post-CMOS Technologies
VLSI Physical Design and EDA
more details: https://iccsd.net/cfp.html

Call for Special Session
Special Sessions may address one or more Tracks, but they should be Organized under a unified theme. Special Sessions are intended to allow projects or any other group of authors to present their own work. It is not expected that open calls for papers are launched for Special Sessions, in order to attract authors or presenters.
Special Sessions will be evaluated according to the following criteria:
– Relevance
– Timeliness
– Technical content
– Novelty
– Overall Recommendation