2027/6/11-2027/6/13
(Online+Offline)
Venue: Hangzhou, China
Publication:
All submissions will be sent for double-blind review. Accepted papers with registration and presentation will be published in Conference Proceedings, and submitted for index by Ei Compendex and Scopus.
Call for Papers
The topics of interest for submission include, but are not limited to:
Track 1: Microwave Devices and Circuit Design
Track 2: Antenna Theory and System Design
Track 3: Microwave Materials and Process Technologies
Track 4: Computational Electromagnetics and Numerical Algorithms
Track 5: Advanced RF Integration and Packaging Technologies
Track 6: Electromagnetic Compatibility and Safety
Track 7: Microwave Measurement and Remote Sensing Technologies
Track 8: Integrated Sensing and Communication (ISAC) Technologies
Track 9: Bioelectromagnetics and Medical Applications
Track 10: AI-Enabled Electromagnetic Engineering Technologies
Submission
1. Full Papers
The manuscript in double-column format should have at least 4 full pages and up to 10 pages. If it exceeds 5 pages, the extra page(s) will be charged. Manuscripts must be written in English and follow the instructions at Manuscript Formatting and Templates.
2. Abstracts
Abstract submissions are also acceptable from authors who only wish to present their work and do not intend to publish it.
Conference Schedule
Day 1: June 11th, 2027
10:00-17:00 Registration and Collect Conference Kits
14:30-16:00 Technical Visit
Day 2: June 12th, 2027
Opening Remarks & Keynote Speech & Parallel Sessions
Day 3: June 13th, 2027
Parallel Sessions
