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2021 4th International Conference on Electron Device and Mechanical Engineering

2021/3/19-2021/3/19

PUBLICATION

1. All papers will be reviewed by two or three experts from the committees. All accepted full papers will be published in Conference Publishing Services (CPS) and will be submitted to EI Compendex and Scopus for indexing.

>>>>Past history

[The Proceedings of Icedme 2020 has been successfully published and indexed by both Ei Compendex and Scopus. The screenshot is as follows.]

EI Compendex



SCOPUS



【The 2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME 2020) was sucessfully held during May 20, 2020 Online.

会议照片.jpg

>>For more history:  www.icedme.org


2. SCI journalSubmission with notes of conference acronyms will enjoy priority in review and acceptance.

Excellent papers will be recommended directly to the following or other suitable SCI journals

Journal 1Journal of Materials Science: Materials in ElectronicsISSN: 0957-4522, IF=2.195, regular issue

Journal 2Thermal ScienceISSN: 0354-9836, IF=1.541, special issue

Submission should be in WORD.docformat only, and specified templates will be given after evaluation.

Online submission AIS online submission

For more information about SCI papers and journals, please feel free to contact Editor LiWeChat/Mobile phone): 18127812811/ Editor LinWeChat/Mobile phone): 13922157504.