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CONFERENCE INFORMATION:

Website：http://www.confecie.org/      

Conference Date：January 22-24, 2021

Venue：Zhengzhou, China

Submission Deadline: Nov. 27, 2020 

Indexing：EI Compendex/ Scopus

International Conference on Electronics, Circuits and information Engineering（ECIE 2021）will be held on January 22-24 in Zhengzhou, China.

ECIE2021 is an international forum for scientists, engineers, and practitioners to present their latest research and development results in all areas of Electronics, Circuits and information Engineering. Conference topics mainly include, but not are limited to Digital electronics, Analogue Electronics, Microelectronics, Circuit design, Integrated circuits, Optoelectronics, Semiconductor devices, Embedded systems and Information Engineering etc. ECIE 2021 welcome all high-quality research papers and presentations from related research fields.

1. Organizer

Co-Organizer

2. Guest structure

Conference Chair

International Organising Committees

Prof. Kamal Kumar Sharma, Lovely Professional University, Punjab

Dr. Kaichen XU, Osaka Prefecture University, Japan

Prof. Taraprasanna Dash, Siksha 'O' Anusandhan, India

Prof. M.Hassaballah, South Valley University, Egypt

Dr. Michal Hodoň, University of Zilina, Slovakia

Dr. Michael Waltl, Vienna University of Technology, Austria

Dr. Prabhat Ranjan, Manipal University Jaipur, India

Dr. Liviu Octavian Mafteiu-Scai, West University of Timisoara, Romania

Dr. Viktor Sverdlov, Vienna University of Technology, Austria

Prof. Yanfeng Jiang, Jiangnan University, China

Prof. Pascal Lorenz, University of Haute Alsace, France

Dr. Shahrizal Jelani, UCSI University, Malaysia

Dr. Farzin Shama, Islamic Azad University, Iran

Dr. S.A. Edalatpanah, University of Guilan, Iran

Dr. Froilan Mobo, Philippine Merchant Marine Academy, Philippines

Prof. S. Rajesh, Mepco Schlenk Engineering College, Sivakasi

Prof. Ang Chun Kit, UCSI University, Malaysia

Prof. Dariusz Jacek Jakobczak, Koszalin University of Technology, Poland

Dr. Anand Nayyar,  Duy Tan University, Vietnam

Dr. Malka N. Halgamuge, The University of Melbourne,  Australia

Dr. Kar Heng Lee, TBSS CENTER FOR ELECTRICAL AND ELECTRONICS ENGINEERING, Singapore

Dr. Ajay B Gadicha, Sant Gadge Baba Amravati University, Amravati, India

Dr. Sérgio Ivan Lopes, Instituto Politécnico de Viana do Castelo, Portugal

Keynote speaker

Prof. Farhad Shahnia         Prof. Pham The Bao          Prof. Yanchao Mao

Murdoch University            Saigon University               Zhengzhou University

Australia                             Viet Nam                            China

Dr. Anand Nayyar            Prof. Panagiotis Papadimitriou

Duy Tan university           University of Macedonia

Viet Nam                          Greece

Keep updating

3.CALL FOR PAPER

The topics of interest for submission include, but are not limited to:

Digital electronics

Analogue electronics

Microelectronics

Integrated circuits

Optoelectronics

Embedded systems

Analog Circuits and Signal Processing

Bioengineering Circuits and Systems

Biomedical Circuits and Systems

Circuit & System Design

Circuits and Systems for Communications

Circuit Simulation & Modeling

Semiconductor Devices and Circuits

Digital Circuits and Signal Processing

Device Simulation & Modeling

Digital Communications

Electronic Design Automation

Integrated Circuit and System Design

Low-Power and Harvesting Techniques

Low-Power, RF Devices & Circuits

Linear & Nonlinear Circuits and Systems

Multimedia Systems and Signal Processing

Neural Network Circuits and Systems

Nanoelectronic Circuits

Photonic and Optoelectronic Circuits

Power and Energy Circuits and Systems

Power Electronics and Applications

RF and Wireless Circuits and Systems

Sensing and Sensor Networks

Test and Reliability

VLSI Systems, Applications and Computer Aided Network Design

Emerging Technologies

Information and Communication Engineering

Artificial Intelligence

Bioinformatics

Software Engineering

VLSI Design and Fabrication

Photonic Technologies

Parallel and Distributed Computing

Data Mining

Cryptography

Algorithms and Data Structures

Graphs and Combinatorics

E-commerce and E-learning

Geographical Information Systems (GIS)

Networking

Signal Processing

Embedded System

Communication and Wireless Systems

Multimedia Systems and Applications

Emerging Technologies

Blockchain

Internet of Things 

4.Publication

*All papers, both invited and contributed, 

will be reviewed by two or three experts from the committees. After peer-review, all accepted papers of ISAIMS 2020 will be published by conference proceedings, and then submit to EI Compendex, Scopus for retrieval.

*High quality papers will be recommended for publication in SCI journal.   

5. Participation Types:

Package A: Only Attendance      

Package B: Abstract Submission+Oral Presentation

Package C: Abstract Submission+Poster Presentation

Package D: Full Paper Publicaiton+Oral/Poster Presentation +Attendance

Note: If you need paper publication and presentation both, please submit full paper.

If you need to make presentation without publication, please submit abstract only.

Submission Methods:

If you choose Package D, please submit the full paper (word+pdf) to SUBMISSION SYSTEM

If you choose Package A, B or C, please register via REGISTRATION SYSTEM .

6.Registration Fee

7.Program

CONTACT US

Conference Secretary: Leah Li

E-mail: contactecie@163.com

Tel: +86 17737319063 (Wechat)

QQ: 978640953 

最新动态：

1. Welcome Prof. Panagiotis Papadimitriou from University of Macedonia, Greece join ECIE 2021 as Keynote Speaker!

2. Welcome Prof. Farhad Shahnia from Murdoch University, Australia join ECIE 2021 as Committee Chair!

3. ECIE 2021 conference registration system opens now!