CALL FOR PAPERS
The topics of interest for submission include, but are not limited to:
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Topic 1: Electronic Technology 3D process and integration technology Substrate embedding and advanced flip chip packaging MEMS and sensor technology Wafer-level CSP and heterogeneous integration Design and Analysis of Transmission System New materials, equipment and 3D interconnection Wearable, flexible and stretchable electronics Optical interconnection and 3D photonics Digital system and logic design Computer architecture and VLSI Network-driven multi-core chip Advanced robotic system Motor Analog and digital electronics Signals and Systems |
Topic 2: Information and Communication Electronic equipment Satellite and Space Communications Network and Information Security Signal processing for wireless communication Cognitive Radio and Software Radio Optical networks and systems Electromagnetic field theory Antenna, propagation and transmission technology Optical communication Radar signal and data processing |
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