The first International Academic Conference of Com__学术会议在线-学术会议云

当前位置：首页 >> 会议频道 >> 查看会议

当前共 14964 个会议

The first International Academic Conference of Com

会议日期：2014-11-10 至 2014-11-12

会议地点：北京市

访问网站

注册咨询

联系方式

会议简介

The first International Academic Con

ference of Computer Science and E-

Communication Engineering

Experts and scholars:

After the entry of 21st century, more and more projects have to be exploited and finished by computer science and the technology of electronic communication engineering. The research content and specialized subject of computer science and E-communication engineering are widened rapidly and diversely. New technology innovation tends to be active, especially for artificial intelligence, computer graphics and vision, software engineering, information science, programme-controlled exchange, optical fiber communications. Innovative development of new technologies and new achievements promotes the progress of society in all aspects. Computer science and E-communication are facing a great development opportunity.

In order to promote more exchange and cooperation among professional scientific research workers in multidisciplinary and multi-specialty, and improve the effectiveness of international academic exchange, ‘The first international academic conference of computer science and E-communication engineering’ will be held, thus to provide the latest research results of communication for the people engaging in computer science and technology, computer science engineering, scientific calculation of engineering and technology, computer network and communication, as well as the scholars and experts in the field of optoelectronics and optical fiber communication. And it will offer platform for discussing hot issue and technological problem, so as to promote the friendship, mutual understanding and cooperation among related research organizations of science and technology, as well as scientists in China and the whole world. We wish that rational discussion and thinking could be beneficial to the prosperity of the related industry, the resources will be integrated into globe range to realize the sustainable and healthy development of each related industry at the same time.
1. The theme of conference
(1): Computer science and technologyⅠ: Computer hardware architectures, computer software, artificial intelligence and recognition technology, database application and management, computer network, computer aided design, computer graphics.
(2): Computer science and technologyⅡ: Software engineering, structure and algorithm, network programming, microprocessors and interfaces, exploitation of software technology and tools, algorithm design, software system framework.
(3): Computer remote control: Computer measurement, remote control technology, exploitation of automatic control and monitoring system, computer sensor technology control application, and computer intelligent instrument design.
(4): Technology of electronics: Microelectronics, automation, electronic information engineering, embedded system, electromagnetic and wireless technology, integrated circuit design and integration system, image coding, digital logic circuit, circuits and electronics.
(5): Information and optical fiber communication: operation of communication network, exploitation of communication technology, application of information industry, wavelength division multiplexing technology, optical circuit switching, optical soliton communication, modulator and detector.
2.Chairman of the organizing committee（invitation）
Prof. Pit           Chief Editor of   《Journal of Digital Information Management》 EI
Prof. Quan Min Zhu     Chief Editor of 《International Journal of Computer Applications in
Technology》       EI
Prof. Anton         Chief Editor of 《Informatica》  EI
Prof. Sam Zhang       Chief Editor of   《Nanoscience and Nanotechnology Letters》 EI/SCI
Professor Martin Goosey  Chief Editor of   《Circuit World》 and 《Soldering & Surface Mount
Technology》      SCI
Prof. Igor Kabashkin     Chief Editor of   《Computer Modelling and New Technologies》 EI
Francesco Iacoviello     Chief Editor of  《Frattura ed Integrita Strutturale》     EI
3. Conference Information
Sponsor:
IEEE association of international academic exchanges
Organizer:
Ningbo Bauhaus Creative Design and Cultural Planning CO., LTD
Co-sponsor:
International Bauhaus Science Pre
Emerald Group Publishing
Indscience Publishers
Digital Information Research Foundation
Supporting party:

《Circuit World》
《Soldering & Surface Mount Technology》
《Computer Modelling and New Technologies》
《International Journal of Computer Applications in Technology》
《Nanoscience and Nanotechnology Letters》
《Fratturaed Integrita Strutturale》
Meeting Time: November, 2014
Meeting place: Beijing Fairmont Hotel, No.8 Yong'an Dongli， Jianguomen Outer Street, Chaoyang District, Beijing, China
4. The conference notice
1)The conference communication
The representatives attending the conference could communicate in oral presentations (multimedia) or in the form of exhibition board (Poster). Communication language is Chinese and English. Please indicate the way of communication in the reply letter you sent to us. Speaking representatives in conference are asked to inform the organizing committee in advance, so as to make the group of committee affairs convenient to refer to personal will. After the examination and approval of the academic committee, presentation time will be arranged.The representatives who need demo software should give statement in advance. The conference would provide computer and projection equipment, if you need special equipment, please prepare by yourself.
2)Paper submission of conference
①Submission instructions：the paper should be written in English; the content should be consistent with the topic of symposium; the paper is required to strictly comply with the range of draft; the thesis length should be withen 4 pages in principle; categories of quasi publication should be remarked by SCI, EI or PKU.
②The meeting is divided into two drafts：press time of the first round is on July 31; the second round is on September 28. The eventual registration date is on September 28.
③All the papers should be submitted through website: http://www.bhssci.com/tougao/
④Whether employed or not, we will inform the author in the form of mail. If you have not received acceptance or intervies notification, please contact us in the form of E-mail.
⑤The accepted articles in this conference will be published in EI journal:Frattura ed Integrita Strutturale or SCI periodicals:Circuit World，Soldering & Surface Mount Technology , which should be searched in the form of JA. The outstanding articles will be recommended to Computer Modeling and New Technologies (EI), etc in priority. Other articles will be published in core journal of Peking University. After the papers being published, the first author of each article will be sent one sample issue.
⑥Paper costs：the cost will be paid by yourself（The company helps to recommend）
3) Convention expense：

The fee of attending meeting; 1000 yuan / person（The first author's participation fee of each collected papers will be decreased by 500; Transportation and accommodation expenses depend on yourself, the fee of attending meeting should be paid on the scene.)
4)Contact information：

Contact information: IEEE Association of International Academic exchanges
Contact Person: Mr. Wang
Contact number: +85256427031
E- mail: support@bhssci.c

IEEE Association of International Academic exchanges

On June 12, 2014