2019年IEEE第三届电路、系统与器件国际会议【IEEE ICCSD 2019】将于2019年8月23日至25日在【中国成都】举行。会议由IEEE，四川省电子学会，电子科技大学，东南大学，美国底特律大学支持，旨在为全世界科研学者、从业人员以及教育工作者提供一个******的跨学科平台，探讨最近创新发明以及在电路设备与系统领域里面临的现实挑战与解决方法。我们诚挚地邀请您参与ICCSD 2019。

IEEE ICCSD 2019大会接收并注册的全文将被收录到IEEE会议论文集中，由【EI核心与Scopus】等检索。

*会议地点

成都西藏饭店 

地址: 成都人民北路一段10号

 

*征稿主题（不限于以下)

请参考：http://iccds.org/call.html

Circuits, devices and systems

Smart grid and circuit

Signal and multimedia processing

Computers, software and applications

Ocean engineering and marine technology

Biomedical electronics and bioinformatics

Communication engineering

Electronics and electrical engineering

Computer science applications

Nano electro mechanical System

Photonics and optoelectronics

Networking, communication and multimedia

Information engineering

Wireless/Mobile communication and computing

Software specification and software assurance

Analysis of power quality and system stability

Assembly and packaging

Analog circuits and digital circuits

Antenna and propagation

Electric energy processing

Electromagnetic and photonics

Electro-optical phenomena of semiconductors

Power electronics and energy systems

Signal processing

Techniques of laser and applications Of electro-optics

Simulation of propagation

Battery management system

Circuits and electronics

Computer relaying integrated optics and electro-optics devices

Microwave theory and techniques

Microwave and millimeter

Modulation, coding, and channel analysis

Power electronics

Remote control and techniques of GPS

Robotics and atomization engineering

Signal integrity design for high-speed digital systems

Solar power generation

Wind power generation

Submission

*投稿方式

投稿系统：https://easychair.org/conferences/?conf=iccsd2019

*联系我们

会议秘书：罗女士

邮箱:iccsd@academic.net

电话：+86 (0)28 8652-8629

更多会议详情，请登陆 http://iccds.org/