当前共 38426 个会议
The first International Academic Conference of Com
会议日期:2014-11-10 至
2014-11-12
会议地点:北京市
会议简介
The first International Academic Con
After the entry of 21st century, more and more projects have to be exploited and finished by computer science and the technology of electronic communication engineering. The research content and specialized subject of computer science and E-communication engineering are widened rapidly and diversely. New technology innovation tends to be active, especially for artificial intelligence, computer graphics and vision, software engineering, information science, programme-controlled exchange, optical fiber communications. Innovative development of new technologies and new achievements promotes the progress of society in all aspects. Computer science and E-communication are facing a great development opportunity.
In order to promote more exchange and cooperation among professional scientific research workers in multidisciplinary and multi-specialty, and improve the effectiveness of international academic exchange, ‘The first international academic conference of computer science and E-communication engineering’ will be held, thus to provide the latest research results of communication for the people engaging in computer science and technology, computer science engineering, scientific calculation of engineering and technology, computer network and communication, as well as the scholars and experts in the field of optoelectronics and optical fiber communication. And it will offer platform for discussing hot issue and technological problem, so as to promote the friendship, mutual understanding and cooperation among related research organizations of science and technology, as well as scientists in China and the whole world. We wish that rational discussion and thinking could be beneficial to the prosperity of the related industry, the resources will be integrated into globe range to realize the sustainable and healthy development of each related industry at the same time.
1. The theme of conference
(1): Computer science and technologyⅠ: Computer hardware architectures, computer software, artificial intelligence and recognition technology, database application and management, computer network, computer aided design, computer graphics.
(2): Computer science and technologyⅡ: Software engineering, structure and algorithm, network programming, microprocessors and interfaces, exploitation of software technology and tools, algorithm design, software system framework.
(3): Computer remote control: Computer measurement, remote control technology, exploitation of automatic control and monitoring system, computer sensor technology control application, and computer intelligent instrument design.
(4): Technology of electronics: Microelectronics, automation, electronic information engineering, embedded system, electromagnetic and wireless technology, integrated circuit design and integration system, image coding, digital logic circuit, circuits and electronics.
(5): Information and optical fiber communication: operation of communication network, exploitation of communication technology, application of information industry, wavelength division multiplexing technology, optical circuit switching, optical soliton communication, modulator and detector.
2.Chairman of the organizing committee(invitation)
Prof. Pit Chief Editor of 《Journal of Digital Information Management》 EI
Prof. Quan Min Zhu Chief Editor of 《International Journal of Computer Applications in
Technology》 EI
Prof. Anton Chief Editor of 《Informatica》 EI
Prof. Sam Zhang Chief Editor of 《Nanoscience and Nanotechnology Letters》 EI/SCI
Professor Martin Goosey Chief Editor of 《Circuit World》 and 《Soldering & Surface Mount
Technology》 SCI
Prof. Igor Kabashkin Chief Editor of 《Computer Modelling and New Technologies》 EI
Francesco Iacoviello Chief Editor of 《Frattura ed Integrita Strutturale》 EI
3. Conference Information
Sponsor:
IEEE association of international academic exchanges
Organizer:
Ningbo Bauhaus Creative Design and Cultural Planning CO., LTD
Co-sponsor:
International Bauhaus Science Pre
Emerald Group Publishing
Indscience Publishers
Digital Information Research Foundation
Supporting party:
ference of Computer Science and E-
Communication Engineering
Experts and scholars:
After the entry of 21st century, more and more projects have to be exploited and finished by computer science and the technology of electronic communication engineering. The research content and specialized subject of computer science and E-communication engineering are widened rapidly and diversely. New technology innovation tends to be active, especially for artificial intelligence, computer graphics and vision, software engineering, information science, programme-controlled exchange, optical fiber communications. Innovative development of new technologies and new achievements promotes the progress of society in all aspects. Computer science and E-communication are facing a great development opportunity.
In order to promote more exchange and cooperation among professional scientific research workers in multidisciplinary and multi-specialty, and improve the effectiveness of international academic exchange, ‘The first international academic conference of computer science and E-communication engineering’ will be held, thus to provide the latest research results of communication for the people engaging in computer science and technology, computer science engineering, scientific calculation of engineering and technology, computer network and communication, as well as the scholars and experts in the field of optoelectronics and optical fiber communication. And it will offer platform for discussing hot issue and technological problem, so as to promote the friendship, mutual understanding and cooperation among related research organizations of science and technology, as well as scientists in China and the whole world. We wish that rational discussion and thinking could be beneficial to the prosperity of the related industry, the resources will be integrated into globe range to realize the sustainable and healthy development of each related industry at the same time.
1. The theme of conference
(1): Computer science and technologyⅠ: Computer hardware architectures, computer software, artificial intelligence and recognition technology, database application and management, computer network, computer aided design, computer graphics.
(2): Computer science and technologyⅡ: Software engineering, structure and algorithm, network programming, microprocessors and interfaces, exploitation of software technology and tools, algorithm design, software system framework.
(3): Computer remote control: Computer measurement, remote control technology, exploitation of automatic control and monitoring system, computer sensor technology control application, and computer intelligent instrument design.
(4): Technology of electronics: Microelectronics, automation, electronic information engineering, embedded system, electromagnetic and wireless technology, integrated circuit design and integration system, image coding, digital logic circuit, circuits and electronics.
(5): Information and optical fiber communication: operation of communication network, exploitation of communication technology, application of information industry, wavelength division multiplexing technology, optical circuit switching, optical soliton communication, modulator and detector.
2.Chairman of the organizing committee(invitation)
Prof. Pit Chief Editor of 《Journal of Digital Information Management》 EI
Prof. Quan Min Zhu Chief Editor of 《International Journal of Computer Applications in
Technology》 EI
Prof. Anton Chief Editor of 《Informatica》 EI
Prof. Sam Zhang Chief Editor of 《Nanoscience and Nanotechnology Letters》 EI/SCI
Professor Martin Goosey Chief Editor of 《Circuit World》 and 《Soldering & Surface Mount
Technology》 SCI
Prof. Igor Kabashkin Chief Editor of 《Computer Modelling and New Technologies》 EI
Francesco Iacoviello Chief Editor of 《Frattura ed Integrita Strutturale》 EI
3. Conference Information
Sponsor:
IEEE association of international academic exchanges
Organizer:
Ningbo Bauhaus Creative Design and Cultural Planning CO., LTD
Co-sponsor:
International Bauhaus Science Pre
Emerald Group Publishing
Indscience Publishers
Digital Information Research Foundation
Supporting party:
《Circuit World》
《Soldering & Surface Mount Technology》
《Computer Modelling and New Technologies》
《International Journal of Computer Applications in Technology》
《Nanoscience and Nanotechnology Letters》
《Fratturaed Integrita Strutturale》
Meeting Time: November, 2014
Meeting place: Beijing Fairmont Hotel, No.8 Yong'an Dongli, Jianguomen Outer Street, Chaoyang District, Beijing, China
4. The conference notice
1)The conference communication
The representatives attending the conference could communicate in oral presentations (multimedia) or in the form of exhibition board (Poster). Communication language is Chinese and English. Please indicate the way of communication in the reply letter you sent to us. Speaking representatives in conference are asked to inform the organizing committee in advance, so as to make the group of committee affairs convenient to refer to personal will. After the examination and approval of the academic committee, presentation time will be arranged.The representatives who need demo software should give statement in advance. The conference would provide computer and projection equipment, if you need special equipment, please prepare by yourself.
2)Paper submission of conference
①Submission instructions:the paper should be written in English; the content should be consistent with the topic of symposium; the paper is required to strictly comply with the range of draft; the thesis length should be withen 4 pages in principle; categories of quasi publication should be remarked by SCI, EI or PKU.
②The meeting is divided into two drafts:press time of the first round is on July 31; the second round is on September 28. The eventual registration date is on September 28.
③All the papers should be submitted through website: http://www.bhssci.com/tougao/
④Whether employed or not, we will inform the author in the form of mail. If you have not received acceptance or intervies notification, please contact us in the form of E-mail.
⑤The accepted articles in this conference will be published in EI journal:Frattura ed Integrita Strutturale or SCI periodicals:Circuit World,Soldering & Surface Mount Technology , which should be searched in the form of JA. The outstanding articles will be recommended to Computer Modeling and New Technologies (EI), etc in priority. Other articles will be published in core journal of Peking University. After the papers being published, the first author of each article will be sent one sample issue.
⑥Paper costs:the cost will be paid by yourself(The company helps to recommend)
3) Convention expense:
《Soldering & Surface Mount Technology》
《Computer Modelling and New Technologies》
《International Journal of Computer Applications in Technology》
《Nanoscience and Nanotechnology Letters》
《Fratturaed Integrita Strutturale》
Meeting Time: November, 2014
Meeting place: Beijing Fairmont Hotel, No.8 Yong'an Dongli, Jianguomen Outer Street, Chaoyang District, Beijing, China
4. The conference notice
1)The conference communication
The representatives attending the conference could communicate in oral presentations (multimedia) or in the form of exhibition board (Poster). Communication language is Chinese and English. Please indicate the way of communication in the reply letter you sent to us. Speaking representatives in conference are asked to inform the organizing committee in advance, so as to make the group of committee affairs convenient to refer to personal will. After the examination and approval of the academic committee, presentation time will be arranged.The representatives who need demo software should give statement in advance. The conference would provide computer and projection equipment, if you need special equipment, please prepare by yourself.
2)Paper submission of conference
①Submission instructions:the paper should be written in English; the content should be consistent with the topic of symposium; the paper is required to strictly comply with the range of draft; the thesis length should be withen 4 pages in principle; categories of quasi publication should be remarked by SCI, EI or PKU.
②The meeting is divided into two drafts:press time of the first round is on July 31; the second round is on September 28. The eventual registration date is on September 28.
③All the papers should be submitted through website: http://www.bhssci.com/tougao/
④Whether employed or not, we will inform the author in the form of mail. If you have not received acceptance or intervies notification, please contact us in the form of E-mail.
⑤The accepted articles in this conference will be published in EI journal:Frattura ed Integrita Strutturale or SCI periodicals:Circuit World,Soldering & Surface Mount Technology , which should be searched in the form of JA. The outstanding articles will be recommended to Computer Modeling and New Technologies (EI), etc in priority. Other articles will be published in core journal of Peking University. After the papers being published, the first author of each article will be sent one sample issue.
⑥Paper costs:the cost will be paid by yourself(The company helps to recommend)
3) Convention expense:
The fee of attending meeting; 1000 yuan / person(The first author's participation fee of each collected papers will be decreased by 500; Transportation and accommodation expenses depend on yourself, the fee of attending meeting should be paid on the scene.)
4)Contact information:
4)Contact information:
Contact information: IEEE Association of International Academic exchanges
Contact Person: Mr. Wang
Contact number: +85256427031
E- mail: support@bhssci.c
Contact Person: Mr. Wang
Contact number: +85256427031
E- mail: support@bhssci.c
IEEE Association of International Academic exchanges
On June 12, 2014
联系方式
相关会议推荐
2026年云计算、计算机网络与密码学国际会议(ICNC 2026)(2026-8-2)
2026年计算机科学技术与机器学习、大数据国际会议(CSTMLBD 2026)(2026-9-26)
2026年数字图像、计算机视觉与数据建模国际会议(IDVM 2026)(2026-9-11)
2026年网络安全、密码学与软件工程国际学术会议(ICCCSE 2026)(2026-8-3)
2026年计算机、电子技术与软件工程国际会议(CETSE 2026)(2026-8-9)
2026年应用统计、量子计算与大数据国际会议(ASQCBD 2026)(2026-8-9)
2026社会网络分析、计算机科学与媒体学国际会议(SNACSMS 2026)(2026-9-27)
2026年城市规划、可持续发展与数字化转型国际会议(UPSDDT 2026)(2026-7-30)
2026年生物力学与医疗机器人国际研讨会(ISBMR 2026)(2026-8-13)
2026年物联网技术、软件系统与电子工程国际会议(ITTSSEE 2026)(2026-8-20)
相关期刊推荐
相关会议信息
小贴士:学术会议云是学术会议查询检索的第三方门户网站。它是会议组织发布会议信息、众多学术爱好者参加会议、找会议的双向交流平台。它可提供国内外学术会议信息预报、分类检索、在线报名、论文征集、资料发布以及了解学术资讯,查找会服机构等服务,支持PC、微信、APP,三媒联动。
综合推荐区
会议展示区
最新会议信息
-
2026年第五届机器学习、云计算与智 1064
-
2026年第九届可再生能源和电力工程 232
-
2026年第二届计算机视觉与机器学习 1629
-
2026年6月优质国际学术会议推荐 2046
-
2026年人工智能赋能信息与通信系统 328
-
2026资源、化学化工与应用材料国际 3410
-
2026年图像处理与数字创意设计国际 3221
-
2026年机械工程,新能源与电气技术 7709
-
2026年材料科学、低碳技术与动力工 3369
-
2026智能技术、信息工程与现代应用 07-23
-
2026电力工程、新能源技术与智能自 07-23
-
2026土木工程、环境工程与绿色建设 07-23
-
2026材料工程、智能制造与绿色工艺 07-23
-
2026系统工程、智能控制与自动化技 07-23
-
2026工程基建、环境优化与智慧建造 07-23
-
2026年计算机视觉与人工智能国1394

-
2026年第七届国际城市热岛效应824

-
2026年第15届教育和信息技术773

-
2026年第十届材料工程与制造国646

-
2026年第十一届云计算与大数据631

-
2026年第六届人工智能国际研讨627

-
2026年第十四届生物信息学与计616

-
2026年第十二届信息管理国际会598

-
2026年第十届材料工程与纳米科593

-
2025年电力安全与应急技术大会591

2026参会风向标
- 07-24 吴** 注册了 2026年绿色技术、…

- 07-24 宋** 注册了 2026年冶金工程与…

- 07-23 s** 注册了 2026年第七届先进…

- 07-23 王** 注册了 2026年第六届电力…

- 07-23 燕** 注册了 2026年生物科学与…

- 07-22 王** 注册了 2026年海洋工程与…

- 07-22 王** 注册了 2026年轨道交通运…

- 07-22 许** 注册了 2026绿色建材、岩…

- 07-22 许** 注册了 2026年工程地质、…

- 07-22 许** 注册了 2026水利水电、土…

- 07-22 L** 注册了 2026年智能油气、…

- 07-22 许** 注册了 2026年土木工程、…

- 07-22 许** 注册了 2026年结构工程、…

- 07-22 许** 注册了 2026年矿山工程、…

- 07-22 许** 注册了 2026年可再生资源…

- 07-22 许** 注册了 2026年大气科学、…

-
中国健康产业论坛 24558

-
上海熠诺文化传播有限公司 21581

-
中国日用化学工业信息中心 23793

-
亚太科学工程技术协会 26114

-
小汤山温泉度假村 23353

-
重庆立丰展览有限公司 2716

-
沈阳市东北大学 18628

-
上海筱虞文化传播有限公司 8359

-
桂林漓江国际旅行社 2493

-
点石设计公司 2498

-
BGFX 8359

-
中国矿业大学 8657

-
zkppp 8453

-
西南大学 18891

-
百奥泰国际会议中心(大连)有限公 2331

会议分类
[学术会议]
[行业会议]
[论坛峰会]
[培训课程]
[展览展会]
[其他会议]




















4490
0
0









































