第十八届IEEE国际固态和集成电路技术会议

会议日期：2026年10月27日-30日

会议地点：中国 · 杭州

2026 IEEE第十八届国际固态和集成电路技术会议（ICSICT 2026）定于2026年10月27日至30日在杭州举办。由 IEEE 中国联合会、IEEE 北京分会、四川省电子学会及武汉理工大学联合主办，电子科技大学长三角研究院（湖州）承办。

会议组委会
Life Honorary Chair
Yangyuan Wang, Peking University, China

Advisory Committee Co-Chairs
Ting-Ao Tang, Fudan University, China
Cor Claeys, Proximus, Belgium
Mengqi Zhou, IEEE China Council, China

General Chairs
Jan Van der Spiegel, University of Pennsylvania, USA
Bin Zhao, IEEE EDS, USA
Francois Rivet, University of Bordeaux, France
Amara Amara, International Innovation Institute, Beihang University, Hangzhou Campus, China

General Co-Chairs
Ning Xu, Wuhan University of Technology, China
Cheng Zhuo, Zhejiang University, China
Yuehang Xu, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China
Gaofeng Wang, Hangzhou Dianzi University, China

Technical Program Committee Chairs
Haruo Kobayashi, Gunma University, Japan
Ming Li, Peking University, China
Bo Zhang, University of Electronic Science and Technology of China, China
Yi Zhao, Huada Semiconductor, China

Technical Program Committee Co-Chairs
Bei Yu, The Chinese University of Hong Kong, China
Zheng Wang, University of Electronic Science and Technology of China, China
Fakhrul Zaman Rokhani, Universiti Putra Malaysia, Malaysia
Ling Zhang, Zhejiang University, China
Yuchao Yang, Peking University, China
Jing Jin, Shanghai Jiao Tong University, China
Wentong Zhang, University of Electronic Science and Technology of China, China
Haifeng Ling, Nanjing University of Posts and Telecommunications, China

Local Arrangement Chair
Letian Huang, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Subcommittee Chairs
Haifeng Ling, Nanjing University of Posts and Telecommunications, China
Wentong Zhang, University of Electronic Science and Technology of China, China
Jing Jin, Shanghai Jiao Tong University, China
Yuchao Yang, Peking University, China

Subcommittee Co-Chairs
Hailong Jiao, Peking University, China
Zheng Wang, University of Electronic Science and Technology of China, China
Jin Wei, Peking University, China
Zhihao Yu, Nanjing University of Posts and Telecommunications, China

Competition Chairs
Ying Wang, Institute of Computing Technology, CAS, China
Xiangyu Mao, University of Electronic Science and Technology of China, China
Hanru Shao, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Special Session Chairs
Haimeng Huang, University of Electronic Science and Technology of China, China
Kechao Tang, Peking University, China

Tutorial Chairs
Wei Mao, Xidian University, China
Hua Fan, University of Electronic Science and Technology of China, China

Regional Chair
Lobna Said, Nile University, Egypt

Industry Liaison Chairs
Liguang Chen, Shanghai Anlogic Infotech Co., Ltd., China
Sylvain Eimer, Truth Equipment, China
Preet Yadav, NXP Semiconductors, India

Publicity Co-Chairs
Caoyu Li, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China
Chaoyue Zheng, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Publication Committee Chair
Mengqi Zhou, IEEE China Council, China

Publication Committee Co-chairs
Lobna A. Said, Nile University, Egypt
Guoqing Deng, Sichuan Institute of Electronics, China

Treasurer
Jianhong Zhou, Xihua University, China

Secretary General
Tiantian Han, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

会议技术委员会
Theme 1: Digital & System Level IC
Chair: Yuchao Yang, Peking University, China
Co-Chair: Hailong Jiao, Peking University, China

Track 1: Digital Architectures & Systems
Chair: 
Zhiyi Yu, Sun Yat-sen University, China
Co-Chairs: 
Yaoyu Tao, Peking University, China
Hongyang Jia, Tsinghua University, China

Track 2: Digital Circuits
Chair: 
Yongpan Liu, Tsinghua University, China
Co-Chairs: 
Yanan Sun, Shanghai Jiao Tong University, China
Fengbin Tu, Hong Kong University of Science and Technology, China

Track 3: Design Methodology & EDA
Chair:
Jun Yang, Southeast University, China
Co-Chairs:
Yibo Lin, Peking University, China
Yu Li, Zhejiang University, China

Theme 2: Analog
Chair: Jing Jin, Shanghai Jiao Tong University, China
Co-Chair: Zheng Wang, University of Electronic Science and Technology of China, China
Track 4: RF & Wireless
Chair:
Keping Wang, Tianjin University, China
Co-Chairs:
Jian Pang, Shanghai Jiao Tong University, China
Kai Tang, Hunan University, China

Track 5: Wireline
Chair: 
Xiaoyan Gui, Xi'an Jiaotong University, China
Co-Chairs: 
Bingyi Ye, East China Normal University, China
Yuekang Guo, Shanghai Jiao Tong University, China

Track 6: General Analog
Chair: 
Lin Cheng, University of Science and Technology of China, China
Co-Chairs: 
Junmin Jiang, Southern University of Science and Technology, China
Ang Hu, Huazhong University of Science and Technology, China

Theme 3: Devices
Chair: Wentong Zhang, University of Electronic Science and Technology of China, China
Co-Chair: Jin Wei, Peking University, China
Track 7: CMOS Logic Devices & Sensors
Chair:
Heng Wu, Peking University, China
Co-Chairs:
Wang Kang, Beihang University, China
Xiaosheng Zhang, University of Electronic Science and Technology of China, China

Track 8: Power Devices & Power IC
Chair:
Long Zhang, Southeast University, China
Co-Chairs:
Jiafei Yao, Nanjing University of Posts and Telecommunications, China
Zekun Zhou, University of Electronic Science and Technology of China, China

Track 9: Device Reliability & Security
Chair:
Mengyuan Hua, Southern University of Science and Technology, China
Co-Chairs:
Sen Huang, Institute of Microelectronics of Chinese Academy of Sciences, China
Zhao Qi, University of Electronic Science and Technology of China, China

Theme 4: Process & Technologies
Chair: Haifeng Ling, Nanjing University of Posts and Telecommunications, China
Co-Chair: Zhihao Yu, Nanjing University of Posts and Telecommunications, China
Track 10: Semiconductor Process Technologies
Chair:
Bobo Tian, East China Normal University, China
Co-Chairs:
Min Liao, Xidian University, China
Li Zhu, Nanjing University of Posts and Telecommunications, China

Track 11: Optoelectronics and Silicon Photonics Integration
Chair:
Linfeng Sun, Beijing Institute of Technology, China
Co-Chairs:
Ming Xu, Huazhong University of Science and Technology, China
Yuanfang Yu, Nanjing University of Posts and Telecommunications, China

Track 12: Packaging Technologies
Chair:
Jun Zhang, Nanjing University of Posts and Telecommunications, China
Co-Chairs:
Shenyang Mo, NARI Semiconductor R&D Center, China
Pengfei Zhao, Nanjing University of Posts and Telecommunications, China

征稿主题
ICSICT 2026征文范围如下（包括但不限于以下领域）

Theme 1: Digital & System Level IC
Track 1：Digital Architectures & Systems
FPGA Circuits Design & Application
Processors, Accelerators & SoCs
Memory System & Process in Memory
System Level Testability & Reliability

Track 2：Digital Circuits
Digital Blocks
Logical/Physical-Level Security
Non-volatile Memory & Volatile Memory
Circuit Level Reliability Design

Track 3：Design Methodology & EDA
Design for Testability, Reliability & Manufacturability
Modeling，Simulation & Emulation
Design & Technology Co-Optimization
Artificial Intelligence Algorithms for EDA

Theme 2: Analog
Track 4：RF & Wireless
Building Blocks at RF, mm-wave and THz
Rx, Tx or TRx for Wireless Systems
Wireless Sensor, Radar, Imager
Device/Packaging/Modeling at RF, mm-wave and THz

Track 5：Wireline
Electrical/Optical Transmitters/Receivers for Wireline
Clock Generation and Distribution Circuits
Building Blocks for High-Speed Wireline Communications

Track 6：General Analog
Advanced Analog Circuits
High-Speed, High-Precision Data Converters
Imagers, Medical Devices & Display Systems
Efficient Power Management Circuits

Theme 3: Devices
Track 7：CMOS Logic Devices & Sensors
Advanced CMOS Logic Devices
2D & Thin Film Devices & Technologies
Flash & Non-Volatile & 3D Memory Technologies
Sensor, Sensing Microsystem, MEMS, and Bioelectronics
Smart/Intelligent Sensors & Actuators
Device Modeling & Simulation

Track 8：Power Devices & Power IC
Silicon-based Power Devices
Wide Bandgap Power Devices
Power Integrated Circuits、modules & Systems
Power Integrating & Packaging Technology
Power Device Reliability
Power Device Modeling & Simulation

Track 9：Device Reliability & Security
Back-End of Line Reliability & ESD
Aging & Remaining Useful Lifetime Prediction
PUF & Hardware Security
Devices Radiation Reliability

Theme 4: Process & Technologies
Track 10：Semiconductor Process Technologies
Compound Semiconductor Materials & Technologies
Advanced Memory Materials & Technologies
Advanced Process Technologies
Advanced Interconnect Technologies
Process Modeling & Simulation

Track 11：Optoelectronics and Silicon Photonics Integration
High-Speed Optoelectronic Devices
Silicon Photonics & Integration
Photonic Sensors & Image Sensors
Optical Computing Devices
Display Process & Integration

Track 12：Packaging Technologies
2.5D & 3D Integration
Heterogeneous Integration Packaging
Advanced Wire Bonding Technology
Modeling and Simulation for Advanced Packaging
Testing and Reliability in Advanced Packaging

特别分会
Special Session 1: Ferroelectric Materials and Devices
Organizers: Prof. Kechao Tang (Peking University), Prof. Xiao Yu (Xidian University)

Special Session 2: Oxide Semiconductor Devices
Organizers: Dr. Mengwei Si (Shanghai Jiao Tong University), Dr. Sunbin Deng (Huazhong University of Science and Technology)

Special Session 3: Advanced Memory and Computing-In-Memory Circuit Design
Organizers: Assoc.Prof. Chaoyue Zheng (UESTC Yangtze Delta Region Institute), Dr. Yue Zhao (Hefei Normal University)

Special Session 4: Chiplet-based Integrated Systems
Organizers:Prof. Xiaohang Wang (Zhejiang University), Assoc. Prof. Letian Huang (UESTC Yangtze Delta Region Institute)

大会报告嘉宾
Jianjun Luo, Hangzhou Dianzi University, China
大会报告: Non-Volatile Memory Technology & Application Trends in Industry

Mohamad Sawan, Westlake University, China

Paul Penzes, Qualcomm Technologies, USA
大会报告: Engineering the Future: How AI Is Transforming Hardware Design

Wai Tung Ng, University of Toronto, Canada
大会报告: 3D Hetero-Integration of WBG Power Modules with Silicon-based Smart Power ICs

Zewen Liu, Tsinghua University, China
大会报告: GaN-MEMS Sensor and Its Application