会议日期：2027年4月8-11日

会议出版物：
接受且注册成功的论文将发表在下列 Scientific.Net 系列期刊上。
Defect and Diffusion Forum (DDF) (ISSN print 1012-0386 / ISSN web 1662-9507)
Solid State Phenomena (SSP) (ISSN print 1012-0394 / ISSN web 1662-9779)
Materials Science Forum (MSF) (ISSN print 0255-5476 / ISSN web 1662-9752)
Key Engineering Materials (KEM) (ISSN print 1013-9826 / ISSN web 1662-9795)
论文将被 Scopus、Inspec、Chemical Abstracts Service、Google Scholar 等检索。

出版历史：
ICMDA 2025: Vol. 1162. Materials Science Forum-ISBN: 978-3-0364-0958-0-已被 Scopus 检索
ICMDA 2024: Vol. 1128. Materials Science Forum-ISBN: 978-3-0364-0681-7 已被 Scopus 检索
ICMDA 2023: Vol. 1099. Materials Science Forum-ISBN: 978-3-0364-0438-7 已被 Scopus 检索
ICMDA 2022: Vol. 931. Key Engineering Materials-ISBN: 978-3-0357-2847-7 已被 Scopus 检索
ICMDA 2021: Vol. 324. Solid State Phenomena-ISBN: 978-3-0357-1859-1 已被 Ei Compendex & Scopus 检索
ICMDA 2020: Vol. 1009. Materials Science Forum-ISBN: 978-3-0357-1688-7 已被 Ei Compendex & Scopus 检索
ICMDA 2019: Vol. 972. Materials Science Forum-ISBN: 978-3-0357-1530-9 已被 Ei Compendex & Scopus 检索
ICMDA 2018: Vol. 937. Materials Science Forum-ISBN: 978-3-0357-1377-0 已被 Ei Compendex 和 Scopus 检索

会议委员会
Conference Chair
Takashige Omatsu, Chiba University, Japan

Program Chairs:
Masahiro Nomura, The University of Tokyo, Japan
Kwang Leong Choy, Duke Kunshan University, China

Technical Program Chairs:
Yoshio Kobayashi, Ibaraki University, Japan
Anatoly Zinchenko, Nagoya University, Japan
Tomoya Oshikiri, Tohoku University, Japan

Publicity Committee:
Masayuki Nishi, Kyoto University of Advanced Science, Japan
Pengyong Hoo, Universiti Malaysia Perlis (UniMAP), Malaysia
Mohanad Alabdullah, Deakin University, Australia
Yu-Chih Tzeng, National Central University, Taiwan
......

会议主题：
Track 1: Materials Design and Computational Engineering
Track 2: Advanced Functional Materials and Systems
Track 3: Materials Processing and Manufacturing Technologies
Track 4: Materials Characterization, Performance and Reliability
Track 5: Sustainable Materials and Energy Technologies
Track 6: Materials Applications for Intelligent and Emerging Engineering